At the moment I'm connecting the third layer to the via vith a track.
Could this work ?
It is very probably that is OK.
An other solution, could be to create a special footprint component with only a pad which is connected on the right layers (I have not yet tested that).
But I think is not very frequent to have this need.
HTH
--
Danilo Uccelli
CH-2400 Le Locle
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