Hello, i want to do something weird, I want to use through hole components and lay them down as large smd devices, eg: bending leads on TH parts like reverse J, flatpak ,etc...
Has anybody tried this, or point me in the right direction? and since i am new to kicad i cannot find out how to modify the cvpcb footprints as of yet, or how do i tell a 14 pin dil TH footprint not to use other layer when routing (vias only) I don't see a library for doing this.
