Hi, I am considering a design that would use blind and buried vias. However, KiCad rather scarily says it is experimental, and the changelog seems to suggest it cannot yet be used for production. Is it "known not to work" or "should work but untested"?
Would the potential problems be obvious (detected by DRC, for instance) or might problems be silent? (In response to the question "are they absolutely necessary?", I'm not completely sure, but I need to miniaturise a circuit by placing components on both sides and there are also high-impedance signals that I wish to shield with intermediate layers; traversing vias would reduce the shielding.) Best wishes, Boris
