Hi jacobeluz1, The size of the solder paste apertures is currently under discussion in another thread on the list, specifically how to reduce the size of the apertures. axtz4 posted a Perl script a couple of days ago that appears to do the job, though I'm still waiting to hear back from the manufacturer that wanted the size reduction that they got what they wanted. The script modifies the solder paste gerber, and reduces the apertures by the number of millimetres specified on the command line.
Regards, Robert. jacobeluz1 wrote: > Hi. > > 1. when i created the gerber files i noticed that the size of the solder > paste is bigger then the pad itself, this can cause to mutch tin on the pad, > is ther a possability to change the size of the solder paste ? > > 2. when i am trying to put extra vias (for example adding gnd vias ) after a > while (i think after reloading the design again) kicad disconnect the via > from the plan and release the plane around the via > please assist > > > > ------------------------------------ > > Please read the Kicad FAQ in the group files section before posting your > question. > Please post your bug reports here. They will be picked up by the creator of > Kicad. > Please visit http://www.kicadlib.org for details of how to contribute your > symbols/modules to the kicad library. > For building Kicad from source and other development questions visit the > kicad-devel group at http://groups.yahoo.com/group/kicad-develYahoo! Groups > Links > > > > > ------------------------------------------------------------------------ > > > No virus found in this incoming message. > Checked by AVG - www.avg.com > Version: 8.5.283 / Virus Database: 270.11.41/2040 - Release Date: 04/03/09 > 17:54:00 >
