if I understand correctly what you're trying to do (create a solder mask outline smaller than the copper pad?) then it's easy on the latest release - just set negative solder mask and solder paste clearances for those pads in the module editor.
Nick. --- In kicad-users@yahoogroups.com, Anders O <ander...@...> wrote: > > You can create Solder mask defined footprints by stacking two pads on > eachother; the first containing the copper pad and the second containing only > the (smaller) solder mask item. > > This can also be used to decrease the amount of solder paste under IC:s with > large cooling pads (not applicable for BGA:s, of course). > > /Anders > > > > > ________________________________ > From: pwintulich <pe...@...> > To: kicad-users@yahoogroups.com > Sent: Thu, June 10, 2010 2:26:06 PM > Subject: [kicad-users] Via clearences on multi layer PCB's > >  > Hello, > > I have a small 6 layer PCB with 2 BGA parts (Both 0.8mm pitch). > I noticed the Vias have Anulars on all layers rather than just the ones with > trace connections. > > Are there any options to set the layers without trace connection to be drill > and clearence only? > Alternatly has any one written a utility to adjust the gerbers? > The main reason for this is to get a good power feed in under the BGA parts. > I am most interested in applying the change to my power and ground planes. > > My BGA pads are NSMT (Non-Solder Mask Defined) defined at the moment. Has > anyone produced SMT (Solder Mask Defined) BGA footprints? If so what method > was used. > > I think am currently running windows version 20090225-final. I have not found > where to check for added features for newer version of KiCad. > > Regards Peter Wintulich >
