Date: Fri, 8 Sep 2000 16:09:41 -0700 (PDT)
From: [EMAIL PROTECTED]
Subject: Re: heat problem
> 2. open it up (pop out keyboard & heatsink only), apply a super thin layer of
> thermal grease/compound between the cpu and heatsink to ensure a solid contact,
> and reassemble.
Won't the decrease the effectiveness of the current heatsink
compound? Well the little rubbery thing above the cpu and below the
heatsink? Isn't that a heat transfer agent? I know its not a metal to
silcon contact right now..
andy
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