Hello Mark, On 11/17/2015 10:34 AM, Mark Brown wrote: > On Mon, Nov 16, 2015 at 05:00:43PM -0300, Javier Martinez Canillas wrote: > >> Now that I think about it, there is another issue and is that today spi:foo >> defines a namespace while changing to of: will make the namespace flat so >> a platform driver that has the same vendor and model will have the same >> modalias. > >> IOW, for board files will be platform:bar and i2c:bar while for OF will be >> of:NfooT<NULL>Cfoo,bar in both cases. I wonder if we should reuse the type >> for that and store the subsystem prefix there. What do you think? > > I'm not sure that's a big issue - if we end up loading an extra module > with a second bus glue it'll waste a little memory but it's not going to > be a huge amount. Obviously it'd be nice to fix but it doesn't seem > super important compared to getting the modules loaded. >
Agreed, it has indeed lower priority. That's why I added it to my TODO list so it can be fixed later as a follow up. Best regards, -- Javier Martinez Canillas Open Source Group Samsung Research America -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
