This patch adds syscon property for specifying soc-glue core into
DT binding documentation.

Currently, soc-glue core is used for changing the state of S/PDIF
signal output pin to signal output state or Hi-Z state. If you don't
need to use features on soc-glue described above you can ommit this
property.

Signed-off-by: Katsuhiro Suzuki <suzuki.katsuh...@socionext.com>
---
 Documentation/devicetree/bindings/sound/uniphier,aio.txt | 8 ++++++++
 1 file changed, 8 insertions(+)

diff --git a/Documentation/devicetree/bindings/sound/uniphier,aio.txt 
b/Documentation/devicetree/bindings/sound/uniphier,aio.txt
index 65d71cf6ef0f..4ce68ed6f2f2 100644
--- a/Documentation/devicetree/bindings/sound/uniphier,aio.txt
+++ b/Documentation/devicetree/bindings/sound/uniphier,aio.txt
@@ -22,6 +22,12 @@ Required properties:
                     entry in reset-names.
 - #sound-dai-cells: should be 1.
 
+Optional properties:
+- socionext,syscon: a phandle, should contain soc-glue.
+                    The soc-glue is used for changing mode of S/PDIF signal pin
+                    to Output from Hi-Z. This property is optional if you use
+                    I2S signal pins only.
+
 Example:
        audio {
                compatible = "socionext,uniphier-ld20-aio";
@@ -34,4 +40,6 @@ Example:
                reset-names = "aio";
                resets = <&sys_rst 40>;
                #sound-dai-cells = <1>;
+
+               socionext,syscon = <&sg>;
        };
-- 
2.16.2

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