On Tue, 26 Feb 2019, Len Brown wrote:
> This patch series does 4 things.
>
> 1. Parses the new CPUID.1F leaf to discover multi-die/package topology
>
> 2. Export multi-die topology inside the kernel
>
> 3. Update 3 places (coretemp, pkgtemp, rapl) that that need to know
> the difference between die and package-scope MSR.
>
> (Note: Kan Liang has a patch series on top of this one to similarly
> make the uncore perf code multi-die/package aware.)
>
> 4. Export multi-die topology to user-space via sysfs
Aside of the few nitpicks (which apply to several patches) this looks very
nice.
Thanks,
tglx
