From: Zhang Rui <[email protected]> RAPL "package" domains are actually implemented in hardware per-die. Thus, the new multi-die/package systems have mulitple domains within each physical package.
Update the intel_rapl driver to be "die aware" -- exporting multiple domains within a single package, when present. No change on single die/package systems. Signed-off-by: Zhang Rui <[email protected]> Signed-off-by: Len Brown <[email protected]> Acked-by: Rafael J. Wysocki <[email protected]> Cc: [email protected] --- drivers/powercap/intel_rapl.c | 4 ++-- 1 file changed, 2 insertions(+), 2 deletions(-) diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c index 3c3c0c23180b..9202dbcef96d 100644 --- a/drivers/powercap/intel_rapl.c +++ b/drivers/powercap/intel_rapl.c @@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */ /* caller to ensure CPU hotplug lock is held */ static struct rapl_package *rapl_find_package_domain(int cpu) { - int id = topology_physical_package_id(cpu); + int id = topology_logical_die_id(cpu); struct rapl_package *rp; list_for_each_entry(rp, &rapl_packages, plist) { @@ -1459,7 +1459,7 @@ static void rapl_remove_package(struct rapl_package *rp) /* called from CPU hotplug notifier, hotplug lock held */ static struct rapl_package *rapl_add_package(int cpu) { - int id = topology_physical_package_id(cpu); + int id = topology_logical_die_id(cpu); struct rapl_package *rp; int ret; -- 2.18.0-rc0
