On 02/09/2015 11:34 PM, Eduardo Valentin wrote:
This change introduces a section in the Introduction Chapter to
list concepts used by the Thermal Framework.

Signed-off-by: Eduardo Valentin <edubez...@gmail.com>
---
  Documentation/DocBook/thermal.tmpl | 129 ++++++++++++++++++++++++++++++++++++-
  1 file changed, 128 insertions(+), 1 deletion(-)

diff --git a/Documentation/DocBook/thermal.tmpl 
b/Documentation/DocBook/thermal.tmpl
index f8fb8a2..66efed3 100644
--- a/Documentation/DocBook/thermal.tmpl
+++ b/Documentation/DocBook/thermal.tmpl
@@ -84,5 +84,132 @@
                devices.
                </para>

-  </chapter>
+               <sect1 id="glossary">
+                       <title>Glossary</title>
+                       <para>The Linux Kernel Thermal Framework  uses a
+                       specific terminology to represent the entities involved
+                       in thermal constrained environments. This section
+                       summaries the terminology as dictionary. These terms are
+                       in use within the present document and in the source
+                       code of the Linux Kernel Thermal Framework.
+                       </para>
+                       <glossary>
+                               <glossentry>
+                                       <glossterm>Thermal Zone</glossterm>
+                                       <glossdef>
+                                               <para>Thermal zones represent
+                                               what is the current status of a
+                                               thermal constrained zone in the
+                                               hardware. The zone usually is a
+                                               device or component. The status
+                                               of a thermal zone is mainly with
+                                               respect to temperature.
+                                               Currently, the Linux Kernel
+                                               Thermal Framework represents
+                                               temperature in miliCelsius. The

milli-Celsius or millicelsius. Same change later too.

+                                               current abstraction covers for
+                                               non negative temperatures and
+                                               constraints.
+                                               </para>
+                                       </glossdef>
+                               </glossentry>
+                               <glossentry>
+                                       <glossterm>Thermal Sensors</glossterm>
+                                       <glossdef>
+                                               <para>Thermal sensors provide
+                                               temperature sensing capabilities
+                                               on thermal zones. Typical
+                                               devices are I2C ADC converters
+                                               and bandgaps. These are nodes
+                                               providing temperature data to
+                                               thermal zones. Thermal sensor
+                                               devices may control one or more
+                                               internal sensors.
+                                               </para>
+                                       </glossdef>
+                               </glossentry>
+                               <glossentry>
+                                       <glossterm>Trips Points</glossterm>
+                                       <glossdef>
+                                               <para>The trip node describes a
+                                               point in the temperature domain
+                                               in which the system takes an
+                                               action. This item describes just
+                                               the point, not the action. Trip
+                                               points are represented as
+                                               temperature in miliCelsius. The

here

+                                               current abstraction covers for
+                                               non negative temperatures.

One thing I'd also like to see documented is the roles of the different trip types (PASSIVE, ACTIVE, HOT, CRITICAL) and when each should be used.

+                                               </para>
+                                       </glossdef>
+                               </glossentry>
+                               <glossentry>
+                                       <glossterm>Thermal Governor</glossterm>
+                                       <glossdef>
+                                               <para>Thermal Governors
+                                               represent a policy to manage the
+                                               thermal zone device temperature.
+                                               The governor targets to keep
+                                               temperature in an acceptable
+                                               range which correlates to the
+                                               power budget, while maximizing
+                                               the performance. Governors can
+                                               be implemented in Kernel Space
+                                               or in User Space.
+                                               </para>
+                                       </glossdef>
+                               </glossentry>
+                               <glossentry>
+                                       <glossterm>Thermal Cooling 
Device</glossterm>
+                                       <glossdef>
+                                               <para>Cooling devices provide
+                                               control on power dissipation.
+                                               There are essentially two ways
+                                               to provide control on power
+                                               dissipation. First is by means
+                                               of regulating device
+                                               performance, which is known as
+                                               passive cooling. A typical
+                                               passive cooling is a CPU that
+                                               has dynamic voltage and
+                                               frequency scaling (DVFS), and
+                                               uses lower frequencies as
+                                               cooling states. Second is by
+                                               means of activating devices in
+                                               order to remove the dissipated
+                                               heat, which is known as active
+                                               cooling, e.g. regulating fan
+                                               speeds. In both cases, cooling
+                                               devices shall have a way to
+                                               determine the state of cooling
+                                               in which the device is.
+                               </para>
+                                       </glossdef>
+                               </glossentry>
+                               <glossentry>
+                                       <glossterm>Cooling State</glossterm>
+                                       <glossdef>
+                                               <para>Any cooling device has a
+                                               range of cooling states (i.e.
+                                               different levels of heat
+                                               dissipation). For example a
+                                               fan's cooling states correspond
+                                               to the different fan speeds
+                                               possible. Cooling states are
+                                               referred to by single unsigned
+                                               integers, where larger numbers
+                                               mean greater heat dissipation.
+                                               The precise set of cooling
+                                               states associated with a device
+                                               (as referred to be the
+                                               cooling-min-state and
+                                               cooling-max-state properties)
+                                               should be defined in a
+                                               particular device's binding.
+                                               </para>
+                                       </glossdef>
+                               </glossentry>
+                       </glossary>
+               </sect1>
+       </chapter>
  </book>


Cheers,
Mikko.

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