On Mon, Feb 09, 2015 at 09:34:02PM +0000, Eduardo Valentin wrote: > This patch adds a book about the Linux Kernel Thermal Framework. > In this change, only a brief introduction is added together with > Makefile changes. > > Signed-off-by: Eduardo Valentin <[email protected]> > --- > Documentation/DocBook/Makefile | 3 +- > Documentation/DocBook/thermal.tmpl | 88 > ++++++++++++++++++++++++++++++++++++++ > 2 files changed, 90 insertions(+), 1 deletion(-) > create mode 100644 Documentation/DocBook/thermal.tmpl > > diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile > index 9c7d92d..8163508 100644 > --- a/Documentation/DocBook/Makefile > +++ b/Documentation/DocBook/Makefile > @@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \ > 80211.xml debugobjects.xml sh.xml regulator.xml \ > alsa-driver-api.xml writing-an-alsa-driver.xml \ > tracepoint.xml drm.xml media_api.xml w1.xml \ > - writing_musb_glue_layer.xml crypto-API.xml > + writing_musb_glue_layer.xml crypto-API.xml thermal.xml > + writing_musb_glue_layer.xml
Duplicated writing_musb_glue_layer.xml ? Looks like the second line should be removed. > > include Documentation/DocBook/media/Makefile > > diff --git a/Documentation/DocBook/thermal.tmpl > b/Documentation/DocBook/thermal.tmpl > new file mode 100644 > index 0000000..f8fb8a2 > --- /dev/null > +++ b/Documentation/DocBook/thermal.tmpl > @@ -0,0 +1,88 @@ > +<?xml version="1.0" encoding="UTF-8"?> > +<!DOCTYPE book PUBLIC "-//OASIS//DTD DocBook XML V4.1.2//EN" > + "http://www.oasis-open.org/docbook/xml/4.1.2/docbookx.dtd"; []> > + > +<book id="thermal-api"> > + <bookinfo> > + <title>Linux Kernel Thermal Framework API</title> > + > + <authorgroup> > + <author> > + <firstname>Eduardo</firstname> > + <surname>Valentin</surname> > + <affiliation> > + <address> > + <email>[email protected]</email> > + </address> > + </affiliation> > + </author> > + </authorgroup> > + > + <copyright> > + <year>2008-2014</year> > + <holder>Eduardo Valentin</holder> > + <holder>Sujith Thomas</holder> > + <holder>Zhang Rui</holder> > + </copyright> > + <legalnotice> > + <para> > + This documentation is free software; you can redistribute > + it and/or modify it under the terms of the GNU General Public > + License version 2 as published by the Free Software Foundation. > + </para> > + > + <para> > + This program is distributed in the hope that it will be > + useful, but WITHOUT ANY WARRANTY; without even the implied > + warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. > + See the GNU General Public License for more details. > + </para> > + > + <para> > + For more details see the file COPYING in the source > + distribution of Linux. > + </para> > + </legalnotice> > + </bookinfo> > + > +<toc></toc> > + > + <chapter id="introduction"> > + <title>Introduction</title> > + <para>Thermal management is any method or technique implied to > + mitigate emergencies caused by operating devices within > + unsupported temperatures. The challenge consists of designing a > + product keeping the junction temperature of the IC components. > + The operating temperature of IC components used on products must > + operate within their design limits. Besides, temperature towards > + device enclosure must be in a comfort level for the user. > + Therefore, thermal management, by the time of this writing, > + starts in very early device design phase. Managing thermal may > + involve different disciplines, at different stages, such as > + temperature monitoring, floorplanning, microarchitectural > + techniques, compiler techniques, OS techniques, liquid cooling, > + and thermal reliability or security. This document covers what > + the Linux Kernel Thermal Framework provides as abstraction to > + users with respect to thermal management. > + </para> > + <para>One of the first proposals to provide a solution to cover > + the thermal problem appears in the Advanced Configuration and > + Power Interface (ACPI) specification. ACPI provides an open > + standard for device configuration and power management by the > + operating system. However, several computing devices which may > + have thermal issues in the market disregard the ACPI standard. > + Therefore, the Linux Kernel Thermal Framework has been designed > + to serve as abstraction for ACPI and non-ACPI systems. The core > + concepts applies in both types of systems. > + </para> > + <para>The Linux Kernel Thermal Framework has a design which > + represents the different thermal constraints found in an > + end-products. The thermal constraints exist to serve different > + purposes. There two major types of thermal constraints. The are > + first is related to components junction temperature. The second > + is related to the level of comfort while end users are handling > + devices. > + </para> > + > + </chapter> > +</book> Cheers, Javi -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to [email protected] More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
