Every glue layer should be buildable on COMPILE_TEST
Signed-off-by: Felipe Balbi <[email protected]>
---
drivers/usb/dwc3/Kconfig | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/drivers/usb/dwc3/Kconfig b/drivers/usb/dwc3/Kconfig
index b97cde76914d..66943106a69a 100644
--- a/drivers/usb/dwc3/Kconfig
+++ b/drivers/usb/dwc3/Kconfig
@@ -98,7 +98,7 @@ config USB_DWC3_OF_SIMPLE
config USB_DWC3_ST
tristate "STMicroelectronics Platforms"
- depends on ARCH_STI && OF
+ depends on ARCH_STI && OF || COMPILE_TEST
default USB_DWC3
help
STMicroelectronics SoCs with one DesignWare Core USB3 IP
--
2.10.1
--
To unsubscribe from this list: send the line "unsubscribe linux-usb" in
the body of a message to [email protected]
More majordomo info at http://vger.kernel.org/majordomo-info.html
