Hello everybody

I have some news.

This week i tried to extract the bootloader from a flash, but the chip 
was damaged dduring the soldering, either by the iron heat, or static 
electricity, or mechanical stress during "unsoldering"


what i did :
- "unsolder" the flash by pulling it (brutal, next time i will unsolder 
by hot air)
- glue it to a test board
- solder 40 coil wires to the balls
- check electrically the connections via the clamp diodes presence. i 
automated this step.
- check shorts between wires (automated)
- read it out with a microcontroller and send the results to a serial port


the electrical tests fail, there are some clamp diodes lacking (failed 
pins, especially /OE).

some photos of the different steps are available here:
http://f4eru.free.fr/flash/

I will try again as soon as i find another broken nano.

a few advises:
for the unsoldering, i lifted the chip with a blade. This probably 
cracked the die, so next time i will try unsoldering with hot air.
the BGA is glued down, so i do not know how the glue will behave in the 
hot air. lifting the chip was not too difficult, the glue was not too 
strong.
if hte hot air fails, another method is to bend the pcb, then the balls 
renmain on the chip and not on the board like i had. i tried it after 
with hte ram chip, it seems to work .

use very thin wires, i first tried with thicker ones, but it makes 
mechanical stress on the solder joints
use a very thin iron tip, not too hot, because we solder directly to the 
chip.
use a good magnifying glasss and thin tweezers.
static electricity countere measures are needed.
first put solder on 1/2 mm of wire to get rid of the lackering. the iron 
heat together with the flux burns away the lackering. You can use a 
second iron with a normal tip and hotter setting for this part.
then gently and very quickly press the end of the wire onto the ball 
with the iron tip. then place, cut and solder the other end of the wire.

We now can extract the bootloader, but we really need your help !!
We need broken nanos II to succeed ;))



bye everybody

sto




Emmanuel Fleury a écrit :
> Emmanuel Fleury wrote:
>   
>> I'm currently in a conference in Budapeste, I'll be writing an update
>> about what the students did after my return.
>>
>> Basically, they do not have any 100% proved facts but they proved me
>> wrong and they are considering RC4 as a good candidate.
>>
>> About the chip, I'll try to make some progress when I'll have some time
>> as well.
>>     
>
> I'm back but I'm a bit overloaded with work. I'll do the report summary
> as soon as I can.
>
> Stay tunned (and don't hesitate to DO something better than asking for
> some updates... It's kind to ask but I prefer people who do actually
> produce things ! ;)).
>
> Regards
>   


_______________________________________________
Linux4nano-dev mailing list
[email protected]
https://mail.gna.org/listinfo/linux4nano-dev
http://www.linux4nano.org

Reply via email to