> Secondly, One *should* use some sort of thermally conductively compound
> between your processor and heatsink. The truth of the matter is that the
> joint made between the bare heat disapator on the processor (Using the
> Socket7 type example since we are talking about the Cyrix MII 233 processor)
> and your heat sink is a very poor conductor of heat. The use of the
> thermal conductor compound remedies this. Again.. check
> http://www.cyrix.com for the technical documents that will give you the
> thermal mesurements and such that will help you in designing a proper
> cooling arrangement to keep your processor running.
thirdly, and I'm amazed folks don't consider this sometimes... No matter
HOW good your CPU heat sink is, if the chassis isn't getting enough airflow
in the vicinity of that heatsink, it will have a MUCH harder time keeping
the CPU cool. Adding an extra case fan to move fresh air past the general
vicinity of the CPU, and paying attention to ribbon cable routing so it
doesn't act as a barrier to airflow can make a HUGE difference.
-jrp
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