John, GR-63 allows you to include Root Cause Analysis in the report. If you determine the cause of the failure, you may find that it is not related to the dust exposure. Is it possible that ESD caused the failure condition? Your assembly is handled after each test. Troubleshooting each board in the shelf to find the failure source will help in your conclusion. Also, what is the product's design life? How relevant is this test to your product. Include those comments in the report, if they apply. Keep in mind that if you remove the assembly from the control of the NRTL, the test conclusion will be that the card/s failed the test. It never hurts to review the test data to confirm that the test was performed correctly. You can also retest with a new assembly, for dust only. If it passes and you have your R.C.A. from the first test, that may be sufficient.
Gary Raper "Kretsch, John" <[email protected]> on 09/18/2000 11:05:55 AM Please respond to [email protected] To: "'[email protected]'" <[email protected]>, "'EMC PSTC'" <[email protected]>, "'TREG Newsgroup'" <[email protected]> cc: (bcc: Gary Raper/Raleigh/TEKELEC) Subject: Hygroscopic Dust Troubleshooting I thought I would try to contact the collective on this one... We have a shelf system that is failing GR-63 hygro dust with excessive bit errors (unit did pass Gaseous contaminants no problem). Air is filtered. Anyone have experiences that they would like to share (non-proprietary of course) about how to trouble-shoot and solve this problem? This was the only GR-63 test to have a failure. Regards, John K.
