I started in PCB manufacture with 'punch and crunch' double sided PCBs and ended up maintaining 24 layer 4 thou track and gap equipment which was cutting edge at the time. Spent 11 1/2 years in CMP going from 64nm on 200mm wafers to 14nm on 300mm wafers. Now 7nm on 400mm wafers are on the horizon.
I hear your pain! On Sunday, January 22, 2017 at 4:45:19 PM UTC, gregebert wrote: > > Thanks for posting. To put things into perspective, I was working on a > 40nm project (the above posting mentions 40-40nm process technology) 10 > years ago, and we actually switched it to 32nm. And that was also 10 years > ago. A lot has changed since then. > > You wouldn't believe the things we did to get 14nm chips working in > high-volume manufacturing. > I'm currently managing a 10nm project, and it's definitely much more > challenging. > > -- You received this message because you are subscribed to the Google Groups "neonixie-l" group. To unsubscribe from this group and stop receiving emails from it, send an email to [email protected]. To post to this group, send an email to [email protected]. To view this discussion on the web, visit https://groups.google.com/d/msgid/neonixie-l/f2c21bae-a1ed-495d-87cd-dc6720386cc8%40googlegroups.com. For more options, visit https://groups.google.com/d/optout.
