On Tuesday, December 18, 2018 at 7:29:36 PM UTC-5, gregebert wrote:
>
> Paul - Can you post some details about the hot-air soldering/reflow you 
> did ?
>
> I'm soldering my SMT devices manually by hand because my casual 
> experimenting with a heat-gun got bubbled PCBs and very hot (and probably 
> damaged) ICs.
>

When doing assembly (as opposed to re-work) a few parts at a time, the idea 
is to pre-heat the board (usually via IR to the underside) to a bit below 
the melting point of the solder paste you're using, then use the air gun to 
melt the solder paste you put under the parts you're soldering. That way 
you don't need a ton of very hot air coming out of the nozzle, since that 
would end up overheating the component before the board got hot enough for 
the paste to stick to the traces. Re-work is a bit more of a mixed bag, 
since you may have components on both sides of the board and the parts 
you're trying to remove are usually larger than the ones you want to leave 
in place - people starting out tend to blow things like resistors / caps 
off the board while heating the part to be removed. Even with the exact 
matching nozzle on the air gun, that air has to go somewhere. Pre-heat also 
helps with this, though you'll likely want a lower temperature so any parts 
on the underside aren't at risk.

Preheating also helps with some through-hole rework - I do a lot of work on 
Cisco boards (8 to 12-layer) and things like power supply caps 
are connected to interior layers that are pretty slab-like. And Cisco 
doesn't seem to like to use relief areas arround those inner-layer holes 

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