Now I see how you've done your layout. No concerns about conductor sizing/shape.
Most of the time when I have SMT pads with a feedthru, they work fine. However on a current project I have a pair of SMT pads with a feedthru, and I have a very difficult time getting proper heating/solder-flow. The device is a large-ish NMOS transistor and the gate signal pin is not making good contact. I have similar structures in many other places on the board where the top and bottom side have SMT pads connected together by a via and they work fine. But this one has different-size SMT pads connected by a via, and that has been a problem on both boards I've built, and at no other location. I suggest you make sure the 4 feedthru holes are larger than minimum-geometry (they look like they probably are) and you may want to pre-fill the feedthrus with solder before mounting Q1. You should then be able to heat from the backside and see good solder-flow on the top-side without actually heating from the top side. That should guarantee a good connection. -- You received this message because you are subscribed to the Google Groups "neonixie-l" group. To unsubscribe from this group and stop receiving emails from it, send an email to neonixie-l+unsubscr...@googlegroups.com. To view this discussion on the web, visit https://groups.google.com/d/msgid/neonixie-l/7aa51a78-b579-4e24-b12b-537232401344%40googlegroups.com.
