I use a manual suction device to get most of the solder out, flex the lead with soldering tip to make sure it's no longer attached to the via, then cleanup with braid after the part is removed. Lastly, clean-of flux with a swab moistened with appropriate cleaner.
Often, it's easier to snip the leads then desolder. Of course, this destroys the component but if your're replacing the part it doesn't matter much unless your want to do failure analysis. But, all you need is a pair of tweezers and you can remove each pin independently. This is how you find out the quality of the PCB; good-quality pcb's can be reworked multiple times. Poor quality will suffer lifted traces after heating + solder-suction on the first attempt. Also, the more hole-clearance for the component lead, the easier to remove solder from the via. -- You received this message because you are subscribed to the Google Groups "neonixie-l" group. To unsubscribe from this group and stop receiving emails from it, send an email to [email protected]. To view this discussion on the web, visit https://groups.google.com/d/msgid/neonixie-l/13827190-6aa8-4a6f-93ca-7741e70930df%40googlegroups.com.
