Hi all,
We have submitted a new draft : draft-ao-nvo3-multi-encap-interconnect-00,
which is goint to propose a different overlay encapsulation interconnection
solution.
Any feedback is welcome.
BR.
Ting Ao
原始邮件
发件人：[email protected] <[email protected]>
收件人：Gregory Mirsky <[email protected]>敖婷00071246;Fan Yongbing
<[email protected]>China Telecom <[email protected]>Greg Mirsky
<[email protected]>
日 期 ：2018年03月02日 14:28
主 题 ：New Version Notification fordraft-ao-nvo3-multi-encap-interconnect-00.txt
A new version of I-D, draft-ao-nvo3-multi-encap-interconnect-00.txt
has been successfully submitted by Ting Ao and posted to the
IETF repository.
Name: draft-ao-nvo3-multi-encap-interconnect
Revision: 00
Title: Multi-encapsulation interconnection for Overlay Virtual Network
Document date: 2018-02-27
Group: Individual Submission
Pages: 9
URL:
https://www.ietf.org/internet-drafts/draft-ao-nvo3-multi-encap-interconnect-00.txt
Status:
https://datatracker.ietf.org/doc/draft-ao-nvo3-multi-encap-interconnect/
Htmlized:
https://tools.ietf.org/html/draft-ao-nvo3-multi-encap-interconnect-00
Htmlized:
https://datatracker.ietf.org/doc/html/draft-ao-nvo3-multi-encap-interconnect-00
Abstract:
For an virtualized overlay network, there are many encapsulations
that may be used. Different customer have their own preference. So
if some of these different encapsulation can be interconnected
together, the virtualized overlay network would be more compatible
and have loose strict on access. This document is going to provide
an architecture of different overlay encapsulation interconnection
and an tranformer gateway for these end station connected to the
virtual network.
Please note that it may take a couple of minutes from the time of submission
until the htmlized version and diff are available at tools.ietf.org.
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