Apologies for cross-posting. We would appreciate it if you could share this
Call for Papers with your network.
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CALL FOR PAPERS
IEEE International Conference on Omni-layer Intelligent Systems
University of Wisconsin–Madison, USA
August 4–6, 2025
https://eur02.safelinks.protection.outlook.com/?url=https%3A%2F%2Fcoinsconf.com%2F&data=05%7C02%7Com-announce%40openmath.org%7C46bf0be708e0485752d008dd76c81baf%7Ccc7df24760ce4a0f9d75704cf60efc64%7C0%7C0%7C638797324046541404%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=thFJqOf8LN9k3AaFFpFgcBqzHtBfqJso9HNYZjRA7w0%3D&reserved=0
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Important Dates:
- Paper Submission (Extended): April 22, 2025
- Special Sessions and Workshop Papers: April 8, 2025
- PhD Forum Submissions: May 13, 2025
- Acceptance Notification: May 31, 2025
- Camera-Ready Submission: June 21, 2025
- Special Session / Workshop / Tutorial Proposal Submission: March 31, 2025
- Industry Forum Proposal Submission: April 15, 2025
Are you interested in contributing to the future of the IoT and AI ecosystem?
Do you want to stay ahead of the curve and explore the latest digital
technologies shaping our world?
Or are you simply curious about IoT, AI, and Big Data, and how they impact
every aspect of our lives, society, and business?
IEEE COINS is the right place for you. IEEE COINS brings together researchers,
engineers, practitioners, and thought leaders from across the globe to share
their insights on cutting-edge developments in AI, IoT, security, low-power
design, robotics, and more.
IEEE COINS offers a multidisciplinary program that includes technical research
papers, industry panels, workshops, and tutorials. The conference aims to
address all critical aspects of the AIoT (AI + IoT) ecosystem.
We invite submissions for original research papers and proposals in the
following areas:
Topical Tracks:
1. Internet of Things: From Edge to Cloud
2. Sensing Devices and Systems for AIoT
3. Circuits and Systems (CAS) Designs for AIoT
4. Communications and Networking for AIoT
5. Artificial Intelligence, Machine Learning, and Cognitive Computing
6. Distributed Ledger Technologies and Blockchain
7. Low Power Design and Automation
8. Security and Privacy
9. Intelligent Robots and Systems
10. Embedded AI
Vertical Tracks:
1. Smart Infrastructure
- Smart Cities
- Energy and Smart Grids
- Smart Agriculture
- Smart Mobility, Transportation, and Logistics
2. Industry 4.0 and Smart Manufacturing
3. Digital Healthcare and Well-being
Special Tracks:
1. Emerging Technologies for Intelligent Systems
2. Generative AI: Systems, Architectures, and Applications
Panels:
1. Diversity, Equity, and Inclusion
2. Industry Talks and Insights
3. Workshops and Tutorials
Organizing Committee:
General Co-Chairs:
- Umit Yusuf Ogras, University of Wisconsin–Madison
- Amit Singh, University of Essex
Technical Program Co-Chairs:
- Fatemeh Afghah, Clemson University
- Priya Panda, Yale University
Publicity Co-Chairs:
- Aly Sabri Abdalla, Mississippi State University
- Nicola Dall'Ora, Guglielmo Marconi University & University of Verona, Italy
- Jaeha Kung, Korea University
- Sumit K. Mandal, IISc Bangalore
- Oktay Cetinkaya, University of Newcastle
For more information, paper templates, and submission guidelines, please visit:
https://eur02.safelinks.protection.outlook.com/?url=https%3A%2F%2Fcoinsconf.com%2F&data=05%7C02%7Com-announce%40openmath.org%7C46bf0be708e0485752d008dd76c81baf%7Ccc7df24760ce4a0f9d75704cf60efc64%7C0%7C0%7C638797324046561411%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=XLu1cHw6qZmhGSd2dSrtwJYDn6SwQKcJrcc7B%2BBLi3A%3D&reserved=0
We look forward to your contributions and hope to see you in Madison in August
2025!
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