You could also use snap in eyelets.  Another method that seems to be coming up is using carbon as a seed on the wall.  This has issues with voids, but you might be able to do a plasma desmear with a vaccum box and a cup of bleach in a microwave.  This is far from ideal though, since the carbon seed won't have good adhesion to the PCB wall.  Then you would need to electroplate this, but a cheap electroplater is pretty cheap.      

On 5/29/06, John Culp <[EMAIL PROTECTED]> wrote:
The best site describing a technique for this is: http://www.thinktink.com/
in particular:
http://www.thinktink.com/stack/volumes/volvi/condink.htm

Professionally made prototype pcb's are inexpensive enough now that I
don't think I'll try this, but have fun!

-John

Robert Spanton wrote:
> I make PCBs at home with a minimum track width of about 0.12mm. I'd
> like to use BGA components in my designs, but possibly the biggest
> problem lies in actually getting the tracks out from under the BGA.
> Looking at other designs, it looks like it's possible to get all the
> tracks out from under the BGA on a 2-sided board but only if you can
> get vias between the pins of the BGAs. Drilling those vias accurately
> is more difficult - hence my need for an x-y table...
>
> Then once you've got those vias, you've got to get some sort of
> conducting stuff through them. I don't think sodlering anything
> through them is an option, as they wouldn't be flat enough to go
> beneath the BGA. The only chemicals I've seen for plating PCBs seem
> quite expensive (for a student!). I'd be interested to know if there's
> anyone who can suggest cheap ways of copper plating the holes.
>
> Rob
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>


--
John R. Culp
[EMAIL PROTECTED]

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