> No. 2 layers, one copper, one conductive silver ink 40 milliohms per square. > Usually you can identify traces that can stand some resistance, then make > those be silver ink jumpers. > > UV cure acrylic "paint" is put down as insulator material, then ink over that > makes a 2-layer topology on one side additively and with no hole drilling, > and ends up cheap and good. > > Voltage planes, if desired, need to be added as a separate board adhered > on/soldered on. > For a pure SMT board zone, a ground plane can be copper adhesive tape and > some soldering > to connect well, but breaks in it because tape is thinner than a board would > not work well > unless butted together neatly and soldered over -- if pressure-adhesive > copper will stay put for that...
This sounds like it might be useful for DIY and for prototypes. But is it good enough for a serious high quality product? How is the long term reliability? Signal integrity? Is anyone using this for real products? If it is less expensive and "good enough", someone is bound to be using it. > PS the same thing could be done for OGD1, except the layout is so > much, probably needs 6 weeks and a prototype test and bugfix run > of 3 boards, I think the lion's share of the cost in OGD1 is the large FPGAs. _______________________________________________ Open-graphics mailing list [email protected] http://lists.duskglow.com/mailman/listinfo/open-graphics List service provided by Duskglow Consulting, LLC (www.duskglow.com)
