On Tue, Apr 5, 2011 at 9:46 PM, Koen Kooi <[email protected]> wrote: > -----BEGIN PGP SIGNED MESSAGE----- > Hash: SHA1 > > On 05-04-11 17:10, Siddharth Heroor wrote: >> From: Siddharth Heroor <[email protected]> >> >> * Syslink is an Inter Processor communication layer for ARM/DSP devices. > > NAK! > > 1) This has way too much copy/paste crud from dsplink that needs to get > cleaned up, some highlights: Yes, I did follow precedence and use what was already present in OE.
> >> +PROVIDES = "ti-syslink-module" >> +PROVIDES += "ti-syslink-examples" >> +PR_append = "j" > > 2) inconsistent whitespace every where, do_compile is the worst > > 3) This really needs to get split into 2 recipes: one for the kernel > modules using module.bbclass and one for the userspace bits. I can split the examples and libraries into two recipes, but we may need the kernel module and libraries to be staged together. What would you suggest I do to keep them together when staging? > > 4) The platform defines seem to be better suited for e.g. ti-paths.inc Would moving all the defines into a separate ti-syslink-env.inc be good or does it have to be in ti-paths.inc. I'm not keen on keep all the syslink defines in ti-paths.inc as its unrelated to the other recipes that use ti-paths.inc. -- Sid _______________________________________________ Openembedded-devel mailing list [email protected] http://lists.linuxtogo.org/cgi-bin/mailman/listinfo/openembedded-devel
