Dear Partners, *Hope you are doing well,*
*Please go through the below job description and let me know if you have anyone.* *Thank you..!* *Job Description :* First Name: Last Name/Surname: Cell Phone: Primary Email: Secondary Email: - Work Authorization: Education : Exp Salary / Hourly Rate : $ Visa Validity date: Total Experience: Relevant Experience: Current Employer: Current Location: Relocation: Availability: All these roles have immediate interview slots. *Job Title:* Automation Engineer - SCADA *Location:* US-OH- *Overview:* • Hands on experience of executing Control & Automation projects for Process & Discrete plants – preferably in Automobiles or CPG • Required - Deep knowledge of Siemens WinCC Open Architecture (erstwhile PVSS from ETM) SCADA application development. • Deep knowledge of using Software Development Kit for WinCC OA. • Good understanding of PLC programming. Should be able to assess various inputs by customer, suggest changes and get approval from customer • Desirable – Rockwell / Mitsubishi / GE / Siemens PLC hardware selection and programming knowledge • Desirable – Knowledge of plant Historians and reporting tools • Desirable – Capability to handle IT projects. Good knowledge of IT project life cycle • Desirable – Knowledge of Instrument selection & Sizing and preparation of Control documents • Outstanding verbal and written communications skills • Ability to analyze the problem and provide solutions during the trouble shooting situations • Ability to identify new opportunities of project from customer. Ability to convert given lead in to a viable project *Primary Skills:* Instrumetion & Control *Job Title:* Requirement Management *Location:* US-CA-Gardena *Overview:* Experience in requirement developmenent(using any RM tools like DOORS and JAMA) Experience in system level knowlegde of Automotive ECUs like BCM, Security sytems, Immobiliser, Audio, Infortainmnet, Instrument Cluster, Telematics, Chassis Control etc Experience in Automotive SW developmenent practices Expereicne in Automotive vehicle busese - CAN, LIN, Flexray, Ethernet DOORS, JAMA *Primary Skills:* *Secondary Skills:* *Educational Qualifications* B.E/B.Tech *Job Title:* Platform SW Engineer - Android BSP *Location:* US-CA-Los Angeles *Overview:* • 7 years of applicable experience in software development with Android BSP and middleware exposure. • Hands on experience configuring, trouble-shooting, and optimizing embedded Linux kernels and middleware. • In conjunction with hardware engineering, bring up new board designs. • Develop and modify product specific kernel drivers. • Experience with multiple types of industry standard I/O and communications interfaces, e.g. USB, Wi-Fi, Bluetooth, Ethernet, Protocol Buffers, ZeroMQ *Primary Skills:* Android, BSP, device driver, Middleware, Linux *Secondary Skills:* Customer Focus Good in problem solving *Educational Qualifications* Bachelor of Engineering *Job Title:* Platform SW Engineer - QNX BSP *Location:* US-CA-Los Angeles *Overview:* • 7 years of applicable experience in software development with expereince in QNX BSP and middleware exposure. • Experience with advanced driver assistance systems. • Experience with CAN and Ethernet Communication. • Expertise working with Git version control. • Expertise in C/C++ programming, and shell scripting. • Experience with unit test, code review, and issue tracking systems. *Primary Skills:* QNX, BSP, device driver, Middleware, Linux *Secondary Skills:* Customer Focus Good in problem solving *Educational Qualifications* Bachelor of Engineering *Title: Embedded SWE Camera* *Location1:** Los Angeles, CA* 1. Experience Camera drivers development 2. Eperience on Camera HAL development 3. Experience on Camera tuning. 4. Experience on C, C++. 5. Knowledge on Camera stack on android. Android, Camera Sensor, , C, Android/Linux drivers,Sensor tuning, HAL, JTAG Regards [image: cid:[email protected]] [image: cid:[email protected]] * Vinay Kumar *| Talent Acquisition Specialist [email protected] <[email protected]> | Mobile: +1 (201) 426 7730 747 Third Avenue, 2nd Floor New York, New York - 10017, USA [image: cid:[email protected]] -- You received this message because you are subscribed to the Google Groups "oraapps" group. To unsubscribe from this group and stop receiving emails from it, send an email to [email protected]. To post to this group, send email to [email protected]. Visit this group at https://groups.google.com/group/oraapps. For more options, visit https://groups.google.com/d/optout.
