Dear Budi,
I forward your message to Rantaunet, a Minangkabau speakers mailing list
from West Sumatra Indonesia (where I am also a member). Who knows, there
might be some interested and talented candidates over there.
Best Regards,
-- Sjamsir Sjarif
====
To: [EMAIL PROTECTED]
From: "Budiyanto Junus" <[EMAIL PROTECTED]>
Date: Mon, 06 Feb 2006 04:16:00 -0800
Subject: [ipa-forum] Intel job openings in Malaysia
Reply-To: [EMAIL PROTECTED]
Dear All,
Intel Malaysia is currently expanding and has many openings for engineers.
Please feel free to forward to those who might be interested.
For further questions, please feel free to contact me at
<mailto:[EMAIL PROTECTED]>[EMAIL PROTECTED]
Thank you and best regards,
Budi
Intel Penang Design Center
Inventing tomorrowsTechnology
Build your career in the Design and Development of the next generation
Intel Microprocessor and Intel Architecture platform Chipsets in Penang,
Malaysia
Intel Penang Design Center designs and develops Intel leading-edge
microprocessor (CPU) and Intel Express Chipsets (Core Logic) solution for
next generation PC platform and computing market segment. The design center
is the only site outside Intel US designing next generation Pentium® 4
microprocessor and advanced IA platform chipsets. The design center is
expanding its responsibility to advance the Intel PC platform into next
level of capability building on Intel latest 65nm and 45nm (nanometers)
process technology.
Be part of the silicon IC design pioneering team in developing tomorrows
Microprocessor, Advanced Northbridge (Memory Controller Hub) and
Southbridge (I/O Controller Hub). Be involved in the exciting challenge of
exploring & creating new technology for PC such as Hyper Treading,
Multicore, Virtualization, Security, Manageability, DDR3, PCI Express,
Wireless LAN (WiFi), Giga bit Ethernet. Successful candidates will be given
a comprehensive class-room and on-job trainings.
We are looking for:
MICROPROCESSOR & CHIPSET DESIGN
* Design Engineering Managers
* Platform & Component Architects
* Silicon Design & Validation Engineers
* Analog Circuit Design Engineers
* Mask Design Engineers
* Design Automation Engineers
· Responsible for the research and development of next generation
Low Power Pentium 4 Microprocessor & Chipsets Silicon Design. Involve in
product definition, prototyping, analog circuit design, develop and
validate First-of-kind industry standard design initiative. Define,
Implement and improve the state of the art design software.
· Work on innovative power/performance optimization and dynamic
power management including energy efficient architecture, power/performance
tradeoff analysis, voltage and clock frequency distribution, dynamic power
management, RTL level power estimation and power efficient architecture
verification.
· BSc, MSc or PhD in Electronics/Computer Engineering. The candidate
should have strong analytical problem solving skills, be able to work
independently and work at various levels of abstraction.
PLATFORM DEVELOPMENT & VALIDATION
* Compatibility Validation Engineers/Technicians
* Circuit Marginality Validation Engineers/Technicians
* Computer Security Evaluation Engineers
* Handheld Computer Validation Engineers
* PC Firmware Engineers
* System Validation Operation Managers
* System Validation Engineers/Technicians
* System Marginality Validation Engineers/Technicians
* System Software Engineers
· Responsible for next generation pre-launch Low Power
Microprocessor, handheld and platform validation, debug and resolution of
detected faults Perform Post-Silicon system validation, electrical
validation, compatibility validation, BIOS validation and debug system on
IA-based platform.
· Be an entrepreneur and bring Intels future desktop microprocessor
and chipset products to market, from definition to product launch. Develop
key technical collateral including Data Sheets, Specification Update,
Platform Design Guides, Application Notes, and other
collaterals/documentation necessary to close design wins and launch products.
· BSc, MSc in Electronic, computer engineering or equivalent. Good
knowledge in Intel Architecture and PC platform, experience in PC system
architecture, BIOS and Driver development. Knowledge in C/C++, x86
assembly, VHDL and other software languages
PACKAGE DESIGN & ELECTRICAL ANALYSIS
· Platform Application Engineering Manager
· Platform Signal Integrity Engineers
· Platform Power Delivery Engineers
· Package Design Engineers
· Thermal/ Structural Engineers
· Package Development Integrator
· Responsible for providing package and platform electrical design &
characterization to ensure successful launch of new product. Be part of
global cross-divisional teams to define silicon, package, and platform
requirements to insure robust electrical network design for both signaling
and power delivery. Involve in design and development of electrical
networks for desktop IA-based CPU packages and platforms.
· Development and automation of new thermal measurement capabilities
IA32 Chipsets Thermal Test Vehicles and Test Boards - Coordination and
communication of project status with internal program teams.
· BSc, MSc or PhD in Electrical, Electronic engineering or
equivalent. Familiar with Electromagnetic and circuit theory, good
knowledge of high speed electrical design, transmission line theory, signal
integrity fundamentals. Experience with Cadence Allegro or APD tool will be
an added advantage.
PRODUCT DEVELOPMENT
* Product Development Engineers
· Responsible for the product development of the Low Power Intel
Architecture CPU and Chipset. Define and deliver Design-for-Test (DFT)
solution to develop highly optimized test vectors by using state-of-the-art
vector conversion tool and methods, integrate and optimize test program
through device and tester characterization. Also responsible to design and
develop relevant test hardware (for example, test interface unit) for
overall device testing solution.
· Manage device silicon debug to check out all the structural and
functional tests. Qualify new products through performing detailed test
program analysis to ensure product startup with low allowable Defects per
Million (DPM) coverage, low test time, high yield performance and meeting
world class product health indicators for factory high volume manufacturing
startup and ramp.
· BSc or MSc in Electronics/Electrical/Computer Engineering with
minimum 2-3 years relevant working experience preferred. Strong analytical
problem solving skill and able to work in a very dynamic environment
independently. High volume manufacturing experience and tester knowledge
will be an added advantage.
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