Rob Studdert wrote: >On 27 Mar 2006 at 14:56, Leon Altoff wrote: > >> From what I have been reading the lead free solder is more brittle than >> solder with lead and more likely to suffer failures. One report I read >> said that adding zinc to tin/silver/copper alloy solder made the break >> jagged instead of clean and enabled the join to continue to function. >> It just doesn't sound as reliable to me. > >I agree, it's not near as good as a lead based solder mechanically but the >solder process isn't so different also surface mount technology places far >less >mechanical stresses on solder joints of course.
I wouldn't be surprised if the lead-free solder required significantly different manufacturing technology when applied, not to standard rigid (epoxy-glass) boards, but the flexible plastic film "circuit boards" that you find in modern cameras.
