The safest practice is to not put vias in pads. If you have to do it, there are three problems that arise: thermal deprivation, solder thieving and blowouts. The first is minimized by using the smallest practical vias having the smallest acceptable thermals to planes and pours, coupled with an assembly reflow process thermal contour which preheats and soaks the board sufficiently long prior to the reflow peak. Unconnected pads on internal layers are best retained to help stabilize the via barrel. The last two can be solved by plugging these particular vias with conductive silver epoxy, sanding flush, and then plating over with copper such that a flat pad results without a visible hole and which meets co-planarity requirements.

Jeff Condit
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----- Original Message ----- From: "é" <[EMAIL PROTECTED]>
To: "Protel EDA Discussion List" <[EMAIL PROTECTED]>
Sent: Thursday, October 28, 2004 7:07 PM
Subject: [PEDA] put via under the BGA pad



Hello everyone,

Your replies are really helpful to me. Thank you very much.

1)I want to put via under the BGA pad. But I do not know if there is any problem when to install the BGA chip.

2)Another question, may be a fool question. When I do auto route for a 6-layered board, no track is routed in MidLayer1 and MidLayer2. Could you please tell me what setup must be done.

Thank you very much.

Xiangchen




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