To accommodate the higher solder temperatures, and reduced top pad wetting of lead free alloys, I would like to reduce the solder mask, so that it overlays the pad copper, this should provide extra adhesion for the pad, and reduce the area to be wetted on top of the pcb, when wave soldered.
The problem :- I can overlap the pad with the solder mask by specifying a negative expansion, the default on my system is 4mil, and if I change this to -5mil the solder mask overlays the pads, but I can not find a way to specify the expansion in terms of the pad diameter, so that the negative expansion works for all pad sizes. Any ideas ? Best Regards, Richard Strathie Zot Engineering Ltd Inveresk Mills Industrial Park Musselburgh Scotland, EH21 7UQ Direct Dial Tel : 0131-653-4620 Main Switch Board : 0131-653-6834 Web Site: www.zot.co.uk Email: [EMAIL PROTECTED] This email is sent from the above address and addresses a particular aspect of a job which we are processing Please use the following email address for all data sent to Zot Engineering Ltd for your general sales and enquiries [EMAIL PROTECTED] Pcb Division [EMAIL PROTECTED] Electro-Mechanical Division [EMAIL PROTECTED] Sheet Metal Division ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
