The soldier filled holes act as a thermal conductor. The idea is to draw heat away from the component, spreading it out more efficiently to the rest of the PCB.
____________ Brian G. ----- Original Message ----- From: "Gerhard Fiedler" <[EMAIL PROTECTED]> To: "Protel EDA Discussion List" <[email protected]> Sent: Saturday, July 29, 2006 2:39 PM Subject: Re: [PEDA] Thermal Impedance of Copper Areas > On 2006-07-28 13:32:24, you wrote: > >> If you are trying to get that last little bit of extra thermal cooling, >> if >> your PCB has multiple layers, flood fill the layers under the component >> with >> coper. Also, if you can add a grid of pads around the component which >> may >> be waved/filled with soldier, this can also help. > > Couldn't it be that open holes (not filled with solder) are effective, too > -- in horizontal PCBs? They'd possibly create some additional convection. > > Gerhard > > > ____________________________________________________________ > You are subscribed to the PEDA discussion forum > > To Post messages: > mailto:[email protected] > > Unsubscribe and Other Options: > http://techservinc.com/mailman/listinfo/peda_techservinc.com > > Browse or Search Old Archives (2001-2004): > http://www.mail-archive.com/[email protected] > > Browse or Search Current Archives (2004-Current): > http://www.mail-archive.com/[email protected] ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
