Brad Kosiance wrote:
>Does anyone know of an industry standard source (document) that details the >physical dimensions for surface mount land patterns for packages such as: > >TSSOP > >LFSCP_VQ > >PLCC > >TQFP > > > >or where I can find these details? > > I'm not sure such a document ir relevant or important, unless you want it entirely for "paperwork" reasons. I have had to cange what I believe are "industry standard" patterns to improve alignment during reflow and reduce bridging. It is so process dependent, that tuning these things for best results is what you need to do. Jon ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[EMAIL PROTECTED] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
