FIRST Call for Papers 16TH ANNUAL EUROPEAN CONCURRENT ENGINEERING CONFERENCE-2009 PUSHING THE ENVELOPE ON FULL LIFE-CYCLE PRODUCTION APRIL 15-17, 2009 NOVOTEL, BRUGES, BELGIUM Organised by The European Technology Institute Sponsored by EUROSIS DaimlerChrysler(*) AVNET 3D Ghent University Delft University of Technology Greenbridge NV (*)pending website: http://www.eurosis.org/cms/?q=node/828
CONFERENCE AIM The conference aim of ECEC'2009 is to provide European Researchers witha forum, where they can discuss the latest developments linked toconcurrent engineering focused on European and international researchprojects. ECEC'2009 aims to identify the progress that has been made inConcurrent Engineering over the last year. As part of the sustainabledevelopment research effort, this year's ECEC conference willconcentrate on the full life-cycle production and disposal of goodsproduced using Concurrent Engineering/Lean Manufacturing and simulationtechniques. Another special track will be organized by Delft Universityof Technology on RFID applications. The conference is targeted atindustrial enterprises, industrial associations, universities andresearch institutes.The conference runs in combination withEUROMEDIA'2009 and FUBUTEC'2009. WHO SHOULD ATTEND The conference will be of direct benefit to process, production, designor development managers in manufacturing, strategic directors, qualitymanagers and technical directors. The conference will also be ofinterest to industrial and academic researchers. SCIENTIFIC PROGRAMME The 2009 Concurrent Engineering Europe Conference is structured aroundthe following eleven major topics. A track will be devoted to each ofthese topics in parallel. The conference language is English. * E-Business in CE • Organizational influences of e-business • B2B business models for inter-organizational CE • Migration to e-business based CE • E-business applications for CE • B2B portals for CE • Emerging standards (e.g. XML, UML) • e-procurement, e-supply, e-engineering,... * Organization and Management • Principles of CE • Multi-disciplined team-working and project team organization • Global product development and international collaboration • Life-cycle cost and quality and full life cycle production • Business process re-engineering and outsourcing • Supply chain management • Measurement of profitability by the introduction of CE * Supporting Technologies • Digital Mock-Up • Virtual prototyping • Rapid prototyping • Synthetic environments and simulation on the factory floor • Reverse engineering • Assembly and disassembly • High precision manufacturing • Intelligent manufacturing • Sensor and robot assisted machining * Techniques • Quality function deployment • Total quality management • Global optimization techniques and hybrid approaches * Engineering of embedded systems • HW/SW co-design • system development process • specification languages * Engineering Data Management and Information Modeling • Integration of geometrical data and product definition • Product data interchange (PDI) and standards • Data handling, distribution and transformation • Data version control and release management • Corporate technical memory • Design rationale and intent * Engineering Process Management and Modelling • Process planning in continuous, discrete and hybrid processes • Process modeling, monitoring and control • Diagnostics and maintenance • Automated inspection and quality control • Production planning, scheduling and control• • CE metrics • CE process planning, scheduling and simulation • Workflow-management in CE • Project and team coordination * Collaborative CE Environments for Virtual Teams • Cooperative problem solving • CSCW methods and tools • Information and application sharing • Computer-based video and audio conferencing • Conflict resolution techniques • Constraint management • Negotiation, blackboard and agent-based architecture • CORBA based environments and integrated frameworks • Architectures for building CE systems • CE languages and tools • Distributed computing environments • WWW based CE systems • mobile CE systems • Networking and distribution in CE CE enhanced Lean Manufacturing . Work Standardization . 5S Workplace Organization . Visual Controls . Batch Size Reduction . Points of Use Storage . Quality at the Source . Workflow Practice . Improved Information and Product Flow . Cellular Manufacturing . Pull Synchronous Scheduling . Six Sigma Total Quality . Rapid Setup . Work Teams for Cell Management & Process Improvement . Simplified scheduling and Kanban inventory management * Practical Applications and Experiences • Practical solutions • Systematic guide-lines • Pitfalls and success stories • Case studies, pilot projects and experiments in aerospace, shipbuilding etc... * Eco-Friendly Production Techniques • Economics of scale: Mixed vehicle production lines • CE and lean manufacturing using economies of scale to build eco-friendly products (like hybrid/electric/hydrogen cars, green ships, windmills, solar parks, nuclear power stations, fission power, fusion power etc...) • New material integration as ultralight steel and high strength steel, carbon fiber, aluminium and glass • CE as a tool for new product development production for electric motors, hybrids, fuel cells, battery powered cars KEYNOTE AND INVITED SPEAKERS ECEC´2009 will feature one Keynote Speaker. Focusing on the main tracks of the Conference, invited speakers willgive special in-depth presentations in plenary sessions, which will beincluded in the Proceedings of the Conference. Next to the ordinarysessions, workshops will be held where participants can discuss theirresearch, set up joint research projects or help each other to solveproblems; the so-called partners-for-projects sessions. THE STEFFEN SCHWARZ BEST PAPER AWARD The 2009 European Concurrent Engineering Conference will award the bestpaper. from all full paper submissions. This paper will receive theSteffen Schwarz best paper award in memory of Steffen Schwarz, one ofthe founders of this conference, who died in a tragic car accidentafter attending the ECEC2002 conference in Modena, Italy. DEADLINES AND REQUIREMENTS Authors are invited to electronically submit extended abstracts (2-4pages, 2000-6000 words)of their papers, or final paper proposals (6-12pages), written in English, along with a cover sheet for review by theTechnical Program Committee. The submissions are due to arrive by emailto: [EMAIL PROTECTED] by DECEMBER 15, 2008 (EARLY BIRD SUBMISSION) JANUARY 20, 2009 (SUBMISSION DATE) FEBRUARY 5, 2009 (LATE SUBMISSION) Or in order to speed up the electronic committee distribution processuse the abstract submission page. Accepted formats are Word or PDFformats only. The abstracts have to include the title of the proposedpaper, all authors with affiliations; the full address of the principalauthor(with phone and fax numbers and email address); and a list ofkeywords related to the paper contents; and choice of presentation(lecture or poster). They will be reviewed by three members of the International Program Committee. Notification of acceptance or rejection will be sent in the period FEBRUARY 15, 2009 Only original papers, written in English, which have not previouslybeen published elsewhere will be accepted. In case you want to organizea panel discussion, please contact the program chairmen. An author kit with complete instruction for preparing a camera-readycopy for the proceedings will be emailed to authors of accepted papers.One camera-ready copy of the papers accompanied by an electronicversion in MS Word or PDF must be in by: Camera-Ready Copies: MARCH 25, 2009 PAPER SUBMISSION TYPES FULL PAPER (including abstract, conclusions, diagrams, references)During review, the submitted full papers can be accepted as a regular 5page paper. If excellent, full papers can be accepted by the program committee asan extended (8-page) paper. Each submission will be reviewed by atleast three members of the International Program Committee. EXTENDED ABSTRACT (at least five pages) Participants may also submit a 5 page extended abstract for a regular(5 pages) or short (3 pages) paper or poster, which will be reviewed bythe International Program Committee. All accepted papers will bepublished in the ECEC'2009 Conference Proceedings. SHORT ABSTRACT (at least three pages) Participants may also submit a 3 page abstract for a short paper orposter, which will be reviewed by the International Program Committee.All accepted papers will be published in the ECEC'2009 ConferenceProceedings. ONE PAGE ABSTRACTS ARE NOT ACCEPTED. The final manuscript for extended papers are expected to be 8 pageslong, accepted regular papers are expected to be 5 pages long , whereasthe short papers are approximately 3 pages long (A4, two-column format). In order to guarantee a high-quality conference, the final papers willbe reviewed to check whether the suggestions of the program committeehave been incorporated. The nominees for the best paper awards will beselected as well, from the papers accepted as EXTENDED papers. All EUROSIS Proceedings are indexed by ISI-THOMSON and INSPEC As this event is being held in Belgium, our home country, we arerequired to add on a 21% VAT surcharge. In order for you to get a VATrefund, have your registration paid by your university, institute orcompany as they have a VAT number. If you prepay personally it ispossible you cannot reclaim the VAT. All prices below are without VAT. REGISTRATION FEES Registration Authors EUROSIS Other Fees Members Participants Pre-Reg before 495 Euro 495 Euro 555 Euro March 25, 2009 Reg after Pre- March 25, 2009 registration 535 Euro 595 Euro Required Registration fees should preferably be paid in EUROs, but can also be paid in the equivalent amount of US$ or GBP.. Payment is possible by Creditcard (VISA, MASTER, AMEX, DINERS) The registration fee includes one copy of the Conference Proceedings,coffee and tea during the breaks, all lunches, a welcome cocktail, theconference dinner and a company visit.(this last item is dependent oncompany availability) Author Registration Authors are expected to register early (at a reduced fee) and to attend the conference at their own expense to present the accepted papers. Without early registration and payment, the paper will not be published in the Conference Proceedings. VENUE The ECEC 2009 will be co-located with the FUBUTEC 2009/EUROMEDIA 2009(Multimedia, Telematics, and Web Technology) conference. Payingregistration for either one of the conferences allows you to visitsessions from all three conferences. The conference itself is held in the beautiful Medieval city of Bruges (an UNESCO Heritage site) known as the Venice of the North. http://www.brugge.be http://foto.brugge.be/slides/slides.htm All conferences are co-located at the Novotel Brugge Centrum. http://www.novotel.com/gb/hotel-1033-novotel-brugge-centrum/index.shtml which is located in the very heart of the historic city of Bruges. EXHIBITS A possibility to exhibit will be available to those interested. More information can be found on the conference website. VENDOR SESSIONS, DEMONSTRATIONS AND VIDEO PRESENTATIONS For demonstrations or video sessions, please contact EUROSIS at the European Office. Special sessions within the scientific program will be set up for vendor presentations. OTHER ORGANIZED MEETINGS A TC meeting will be held in the context of the EUROSIS TCs CONFERENCE VISIT A visit will be envisaged to a company relevant to the conference. In this case it will be New Holland in Zedelgem, just outside Bruges. http://www.cnh.com/wps/portal/cnhportal The conference dinner will be held at the Huisbrouwerij Halve Maan http://www.halvemaan.be/ The get-together party will be in the townhall on the firts evening CORRESPONDENCE ADDRESS Philippe Geril EUROSIS Greenbridge NV Wetenschapspark 1 Plassendale 1 B-8400 Ostend, Belgium Tel: +32 59 255.330 Fax: + 32 59.255.339 Email: [EMAIL PROTECTED] Further information about the 2009 European Concurrent EngineeringConference can be found on WWW under:http://www.eurosis.org/cms/?q=node/828 REPLY CARD First Name.................................................................... Last Name: .................................................................. Occupation and/or Title....................................................... Affiliation:................................................................... Mailing Address:.............................................................. ................................................................................ Zipcode:...................................................................... City:......................................................................... Country:....................................................................... Telephone:......................................Fax:.......................... E-mail:........................................................................ Yes, I intend to attend the 2009 Concurrent Engineering Europe Conference: [] Proposing a paper [] Proposing a panel discussion [] Participating in a vendor session [] Contributing to the exhibition [] Without presenting a paper The provisional title of my paper / poster / exhibited tool is: ............................................................................ ............................................................................ With the following highlights: ............................................................................ ............................................................................ The paper belongs to the category (please tick one): [] 1 e-Business in CE [] 2 Organization and Management [] 3 Supporting Technologies [] 4 Techniques [] 5 Engineering of Embedded Systems [] 6 Engineering data management and information modeling [] 7 Engineering process management and simulation [] 8 Collaborative CE environments for virtual teams [] 9 CE Enhanced Lean Manufacturing [] 10 Practical applications and experiences [] 11 Eco-Friendly Production Techniques [] Track on RFID Technology (*)Pending The paper will be submitted as a: [] Extended paper [] Regular Paper [] Short Paper [] Poster [] Product Presentation Other colleague(s) interested in the topics of the conference is/are: Name: ......................................................................... Address: ......................................................................... ...............................................................................
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