In a message dated 8/23/2001 4:03:21 AM Eastern Daylight Time, [EMAIL PROTECTED] writes: > [EMAIL PROTECTED] Here's an excerpt from one of Intel's datasheet concerning the tenting of BGA vias: "Intel recommends tenting the via’s on the bottom side of the board to minimize heat transfer to the balls during reflow. Tenting via’s on the top-side of the board to minimize the risk of solder-wicking is optional and left to the customer’s discretion. It should be noted that tenting on both sides allows no relief for trapped gasses." * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * - or email - * mailto:[EMAIL PROTECTED]?body=leave%20proteledaforum * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
