In a message dated 8/23/2001 4:03:21 AM Eastern Daylight Time, 
[EMAIL PROTECTED] writes:

> [EMAIL PROTECTED]

Here's an excerpt from one of Intel's datasheet concerning the tenting of BGA 
vias:

"Intel recommends tenting the via’s on the
bottom side of the board to minimize heat transfer to the balls during 
reflow. Tenting via’s on the top-side of
the board to minimize the risk of solder-wicking is optional and left to the 
customer’s discretion. It should be
noted that tenting on both sides allows no relief for trapped gasses."

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