I agree with Brad

Mike Reagan
----- Original Message -----
From: Brad Velander <[EMAIL PROTECTED]>
To: 'Protel EDA Forum' <[EMAIL PROTECTED]>
Sent: Wednesday, April 03, 2002 2:07 PM
Subject: Re: [PEDA] WANTED: PCB Expert (Off Topic)


Darryl, Henry, Mark,
just as a point of discussion, I don't see the issue that you allude
to. The nickel and copper are reasonably well matched. The nickel and copper
are typically just either side of the laminate CTE. Nickel must be thicker
then gold in any reasonable plating application and gold is so ductile, I
can't see the gold effecting bow or twist. Please share any comments,
possibly you know something that I have never seen nor heard of. If it's
fine with you we can take this to OT the forum.

Sincerely,
Brad Velander.

Lead PCB Designer
Norsat International Inc.
Microwave Products
Tel   (604) 292-9089 (direct line)
Fax  (604) 292-9010
email: [EMAIL PROTECTED]
http://www.norsat.com

See us at Booth S8155 at NAB 2002 in Las Vegas April 8 - 11.


> -----Original Message-----
> From: Darryl Newberry [mailto:[EMAIL PROTECTED]]
> Sent: Wednesday, April 03, 2002 10:45 AM
> To: 'Protel EDA Forum'
> Subject: Re: [PEDA] WANTED: PCB Expert (Off Topic)
>
>
> Ditto on CTE mismatch & profile.
> Cu = 16.56  m/m* C
> Au = 4.39  m/m* C
> Ni = 12.96  m/m* C
>
> Ni-Au = ??


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