Greetings the List, I have been working on a design that includes a PSSOP package. The package has a heat sink solder lug on the bottom. The footprint calls for a central pad with multiple holes through it between the two rows of pins.
I made the footprint by placing a grid of staggered vias on the central pad. Now I cannot get the vias to connect to the central pad. Since the pad will always be connected to ground, I would like to make it that way in the footprint, rather than on the design. Is it possible to do this? Any suggestions? Thanx, Michael Badillo QTI * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[EMAIL PROTECTED] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
