Hi Jeff,
Jeff Condit wrote:
Provided you have wide spaces between traces, what is the thickest copper (internal/external foil/plating) commonly acceptable to your Fab houses?
I can comment only on 2 layers for wide spaces/tracks. That would be 140um thick + plating (16um for NiAu usually) or could also be solder-plated (PbSn or SnCuAg for example) for high current carrying capacity boards. Been while since done any PSU design thou, so matters may have changed. Most of stuff is multilayer 100um or 150um track/space boards nowadays, 16+(16 NiAu) for outer and 16um inner.
Indrek
-- Indrek Rebane | Borthwick-Pignon Electronics Engineer | Tartu Science Park Phone: (+372) 7 302 641 | Riia 185, 51014 Tartu Fax: (+372) 7 383 041 | Estonia [EMAIL PROTECTED] | www.bps.co.ee
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