On (17 Jan 95) [EMAIL PROTECTED] wrote... > On Tue, 17 Jan 1995 18:20:13 +0100 (MET), Frode Tennebo said:
>> Surface mounted devices: Just the same as ordinary components, >> just SMALLER! > So where does the name come from? (Where do they think I mount the > ordinary devices - in the air?...) If you mount DIP's on the surface then you're doing it wrong! They *mount* through pre-drilled holes thru the PCB. SMD are literally mounted ie soldered to the pads on the same side of the PCB as the chip casing. Some are also glued to the PCB first as that's the only way to secure them prior to soldering. The comercial advantage is less thru-plated holes and higher component density due to smaller packages as there no longer needs to be as much adjacent pin clearance. Though I'm not above converting a DIP device into a SMD and hardwiring it into existing designs;-) Regards Johnathan. PS re 74, HC374 & HC574 they are functionally the same! BUT their D->Q pinout is totally different.. next time look at the pinouts first;-) ... The truth is one thing that nobody will believe. -- |Fidonet: Johnathan Taylor 2:2501/307.9 |Internet: [EMAIL PROTECTED] | | Standard disclaimer: The views of this user are strictly his own.
