Hello Associate,
Greetings for the day! One of our clients in *(**Redmond, WA) *is looking for* (**Mechanical Engg 2 - Display**)* Consultant for the below Position. Kindly find the below Job Description and share me your Profile *Role: Mechnical Engg 2 - Display* Location: Redmond, WA (*Only Locals) Duration: 6+ months Rate: $58/ hr on C2C GC/Citizens H1-B’s (will not consider from JNTU or Osmania University, must be on social networking sites) Minimum 12+ years resume required Development team is seeking qualified candidates to drive and define *touch-display module (TDM) sub-system* at both the component and system level. In this position you will help defining mechanical design, specification for TDM and related system interface and closely collaborate and partner with Tier1, Tier2 development partners in *driving new technology, product development for high volume. Assess technology, Component and system, sub-system process*. This position requires broad *mechanical engineering and high volume manufacturing background.* You will be responsible for the following: • Develop with Microsoft suppliers and the cross-discipline engineering team the touch- display-module (TDM) and help qualify the TDMs for system integration.• *Analyze tradeoffs between display performance, manufacturability and cost*• *Optimize TDM design* for system integration. e.g., overall dimensions, system integration, thermal, reliability, weight.• Evaluate various display mechanical architecture/structure for future products.• *Develop* project documentation including specifications, *3D CAD models, 2D drawings, BOM,* schedules and presentations.• Develop prototypes, fixtures, and test/measurement techniques as necessary for design and manufacturability assessment.• Ensure right level of manufacturability, process controls to ensure mass production ramp • BS, MS, in *Mechanical, Materials* Engineering with 3-5 years’ experience in product development with focus on *electro-mechanical integration of TDM*. • Experience in TDM design, components and architecture and integration of TDM into high volume consumer electronics products.• Experience in use of simulation(*ANSYS*), *DOE, Tolerance analysis and statistical analysis* tools for design optimization• Experience with injection molding, insert molding, adhesives, bonding, lamination desired• Process development, characterization, failure analysis, materials characterization with strong emphasis on reliability, testing, quality by working with overseas suppliers• *Experience with LCD panels, Backlight and subcomponents, PMMA, PC, PCB, FPC Chip on Flex, RF shielding, Thermal management*.• 2+ years hands on experience with *Pro-Engineer(Creo)* 3D solid modeling software required.• Hands on knowledge of structural, thermal FEA analysis and experimental correlation. Thank You, Rajendhar Anugula, Sr.Technical Recruiter *Libsys Inc *'*IT Sharps*' Direct 630-687-1146| Office 630-799-1556 | Fax 630-689-5724 rajendh...@libsysinc.com/ www.LibsysInc.com <http://www.libsysinc.com/> -- You received this message because you are subscribed to the Google Groups "SAP Workflow" group. To unsubscribe from this group and stop receiving emails from it, send an email to sap-workflow+unsubscr...@googlegroups.com. To post to this group, send email to sap-workflow@googlegroups.com. Visit this group at https://groups.google.com/group/sap-workflow. For more options, visit https://groups.google.com/d/optout.
