kidstypike wrote: > I emailed Lincoln Binns asking if they intended manufacturing a PI-BOX > Pro for the Pi4, MD's reply was: > > We sure do, The new Pi is arriving today (Tuesday) and we just need to > check measurements and make a prototype before its full launch.
Interesting case, didn't know about that one. I have a Rock64 in an aluminium housing that uses the case as a heatsink, a little extruded part of the case makes contact with the cpu and memory (through heat conducting foil). It really helps to keep the temps down. Would the PI4 need anything like that (or benefit from it)? The Lincoln Binn casing looks like it could do something like that, with the internal plate. Performance and heat production still go togeteher, even on a 'simple' SBC. ------------------------------------------------------------------------ NeverSimple's Profile: http://forums.slimdevices.com/member.php?userid=36242 View this thread: http://forums.slimdevices.com/showthread.php?t=110690 _______________________________________________ discuss mailing list discuss@lists.slimdevices.com http://lists.slimdevices.com/mailman/listinfo/discuss
