On Monday 09 March 2009 01:30:48 oecherexpat wrote:
I tried to create a fiducial. PCB manufacturer's requirement is to have a
round copper pad of 1mm diameter with a copper-free and solder-resist-free
area of 3mm around it. Creating the solder-resist-free area is no problem
but to have the area copper-free I added a little copper ring of 3mm
diameter. Unfortunateley, the zone filling function does not care about the
copper ring and just over-fills it.
Ensure your copper ring is in the same layer as zone filling.
When designing the ring, see to that it is connected to an unused component
part. This way, the zone filler will avoid it.
//Dan, M0DFI
Anyone with an idea how to solve this?
Thanks, Heiko