Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 10/7/2013 3:32 PM, Eduardo Valentin wrote: On 07-10-2013 13:52, Wendy Ng wrote: On 10/7/2013 9:12 AM, Eduardo Valentin wrote: On 07-10-2013 10:52, Eduardo Valentin wrote: On 04-10-2013 18:17, Wendy Ng wrote: Hello Eduardo, Hello Wendy, I have rebased my work on the top of yours and tried out the new way of registering the thermal zone.The new method is certainly making things easier for me to create a new thermal zone device driver. But I have some questions and I hope to hear back from you before I upload my new patch set that is based on your changes. Great that you gave it a shot. Thanks for that. 1. I found that the hwmon sysfs interface is no longer created when I call thermal_zone_of_sensor_register() to register my thermal sensor. I believe it is because you purposely hard-coded 'no_hwmon' to true. Would it be possible to let the users to control this option as part of the sensor register function? Hmmm.. I also thought of allowing the thermal to hwmon interface configurable. But the interface gets created in different path from the sensor registration, which makes things a bit harder. The zones are probed while parsing the DT file. While the sensors get linked, thermal_zone_of_sensor_register(), typically when sensors are probed. Do you have a real use case for using the thermal to hwmon interface? Durgadoss (original author) and Rui were considering deprecating and finally removing it. If yes, it is time to rise your voice here. 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned value in order to conforms with the thermal framework 'get_temp' function prototype. But the new sensor interface 'get_temp' callback function (defined in __thermal_zone struct) expects 'temp' to be signed. So technically, a negative value can be returned from the underlying sensor function. Should some checks be added to of_thermal_get_temp() to ensure that a negative value (i.e. a very large unsigned value) won't be passed back to the thermal framework? Or should the 'get_temp' function prototype in __thermal_zone struct be changed with 'unsigned' temperature value and it will be the responsibility of the underlying function to do the check? I could for sure, add a warning inside of_thermal_get_temp(). But in general, I believe the thermal framework has to cover for signed temperature values, even if typical usage is on positive temperature range. Mainly for correct temperature representation. 3. Your documentation (thermal.txt) seems to suggest that the 'cooling-attachments' are one of the required properties for 'thermal-zones' node in the device tree binding files. However, I don't Hmm... That was not the intention. have any cooling device ready in my current patch series yet and therefore I tried to leave out the 'cooling-attachments' node from the 'thermal-zones' node. It seems to be working just find and I can register the sensor and read out the temperature once the target platform has been booted up. Is this your expectation that people can leave the 'cooling-attachments' node out?I want to make sure I can still submit a new patch set for this series with just the functionality of reading out the temperature from the thermal sensor. So, let me try to clarify a couple of things. First thing is that the cooling-attachments has been renamed to cooling-maps, just a new naming convention. Also, there are thermal zones that do not have cooling-maps, they just describe thermal shutdown by software, thermal zones with only CRITICAL trip points, for instance. For this reason, thermal zones must be probed properly without cooling-maps. I need to double check the documentation in this case, I believe. Just to clarify a bit, this does not mean we should allow having thermal zones only for monitoring. If you are generating a thermal zone, it means you want to cover thermal limits. The example I gave was a thermal zone that does not have cooling-maps, but it does have a thermal constraint, a trip point which is CRITICAL, meaning, the silicon state is not reliable anymore. Hi Eduardo, Thanks for your clarification.Yes, there are thermal limits that I need to specify through the trip points. The issue I am facing is that I don't have the cooling device that needs to be associated with the trip point in this patch series yet. I was hoping to get the thermal sensor driver code into the mainline first. The addition for the cooling device and the "cooling-maps" node will be added in another patch series. Wendy, Let me try to understand it properly. What cooling device is missing? Is it only the kernel code or the its DT bindings too? Does it prevent you to define the bindings? I believe it should be fine to have the bindings without the kernel code (as long as the bindings are correct). I have also tried this patch series on top of a systems with missing cpufreq support. That means, I had all the thermal bindings, but the cooling device was not loaded in
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 07-10-2013 13:52, Wendy Ng wrote: > > On 10/7/2013 9:12 AM, Eduardo Valentin wrote: >> On 07-10-2013 10:52, Eduardo Valentin wrote: >>> On 04-10-2013 18:17, Wendy Ng wrote: Hello Eduardo, >>> Hello Wendy, >>> I have rebased my work on the top of yours and tried out the new way of registering the thermal zone.The new method is certainly making things easier for me to create a new thermal zone device driver. But I have some questions and I hope to hear back from you before I upload my new patch set that is based on your changes. >>> Great that you gave it a shot. Thanks for that. >>> 1. I found that the hwmon sysfs interface is no longer created when I call thermal_zone_of_sensor_register() to register my thermal sensor. I believe it is because you purposely hard-coded 'no_hwmon' to true. Would it be possible to let the users to control this option as part of the sensor register function? >>> Hmmm.. I also thought of allowing the thermal to hwmon interface >>> configurable. But the interface gets created in different path from the >>> sensor registration, which makes things a bit harder. The zones are >>> probed while parsing the DT file. While the sensors get linked, >>> thermal_zone_of_sensor_register(), typically when sensors are probed. >>> >>> Do you have a real use case for using the thermal to hwmon interface? >>> Durgadoss (original author) and Rui were considering deprecating and >>> finally removing it. If yes, it is time to rise your voice here. >>> 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned value in order to conforms with the thermal framework 'get_temp' function prototype. But the new sensor interface 'get_temp' callback function (defined in __thermal_zone struct) expects 'temp' to be signed. So technically, a negative value can be returned from the underlying sensor function. Should some checks be added to of_thermal_get_temp() to ensure that a negative value (i.e. a very large unsigned value) won't be passed back to the thermal framework? Or should the 'get_temp' function prototype in __thermal_zone struct be changed with 'unsigned' temperature value and it will be the responsibility of the underlying function to do the check? >>> I could for sure, add a warning inside of_thermal_get_temp(). But in >>> general, I believe the thermal framework has to cover for signed >>> temperature values, even if typical usage is on positive temperature >>> range. Mainly for correct temperature representation. >>> >>> 3. Your documentation (thermal.txt) seems to suggest that the 'cooling-attachments' are one of the required properties for 'thermal-zones' node in the device tree binding files. However, I don't >>> Hmm... That was not the intention. >>> have any cooling device ready in my current patch series yet and therefore I tried to leave out the 'cooling-attachments' node from the 'thermal-zones' node. It seems to be working just find and I can register the sensor and read out the temperature once the target platform has been booted up. Is this your expectation that people can leave the 'cooling-attachments' node out?I want to make sure I can still submit a new patch set for this series with just the functionality of reading out the temperature from the thermal sensor. >>> So, let me try to clarify a couple of things. First thing is that the >>> cooling-attachments has been renamed to cooling-maps, just a new naming >>> convention. Also, there are thermal zones that do not have >>> cooling-maps, they just describe thermal shutdown by software, thermal >>> zones with only CRITICAL trip points, for instance. For this reason, >>> thermal zones must be probed properly without cooling-maps. I need to >>> double check the documentation in this case, I believe. >> Just to clarify a bit, this does not mean we should allow having thermal >> zones only for monitoring. If you are generating a thermal zone, it >> means you want to cover thermal limits. The example I gave was a thermal >> zone that does not have cooling-maps, but it does have a thermal >> constraint, a trip point which is CRITICAL, meaning, the silicon state >> is not reliable anymore. > Hi Eduardo, > > Thanks for your clarification.Yes, there are thermal limits that I > need to specify through the trip points. The issue I am facing is that > I don't have the cooling device that needs to be associated with the > trip point in this patch series yet. I was hoping to get the thermal > sensor driver code into the mainline first. The addition for the > cooling device and the "cooling-maps" node will be added in another > patch series. Wendy, Let me try to understand it properly. What cooling device is missing? Is it only the kernel code or the its DT bindings too? Does it prevent you to define the bindings?
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 10/7/2013 9:12 AM, Eduardo Valentin wrote: On 07-10-2013 10:52, Eduardo Valentin wrote: On 04-10-2013 18:17, Wendy Ng wrote: Hello Eduardo, Hello Wendy, I have rebased my work on the top of yours and tried out the new way of registering the thermal zone.The new method is certainly making things easier for me to create a new thermal zone device driver. But I have some questions and I hope to hear back from you before I upload my new patch set that is based on your changes. Great that you gave it a shot. Thanks for that. 1. I found that the hwmon sysfs interface is no longer created when I call thermal_zone_of_sensor_register() to register my thermal sensor. I believe it is because you purposely hard-coded 'no_hwmon' to true. Would it be possible to let the users to control this option as part of the sensor register function? Hmmm.. I also thought of allowing the thermal to hwmon interface configurable. But the interface gets created in different path from the sensor registration, which makes things a bit harder. The zones are probed while parsing the DT file. While the sensors get linked, thermal_zone_of_sensor_register(), typically when sensors are probed. Do you have a real use case for using the thermal to hwmon interface? Durgadoss (original author) and Rui were considering deprecating and finally removing it. If yes, it is time to rise your voice here. 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned value in order to conforms with the thermal framework 'get_temp' function prototype. But the new sensor interface 'get_temp' callback function (defined in __thermal_zone struct) expects 'temp' to be signed. So technically, a negative value can be returned from the underlying sensor function. Should some checks be added to of_thermal_get_temp() to ensure that a negative value (i.e. a very large unsigned value) won't be passed back to the thermal framework? Or should the 'get_temp' function prototype in __thermal_zone struct be changed with 'unsigned' temperature value and it will be the responsibility of the underlying function to do the check? I could for sure, add a warning inside of_thermal_get_temp(). But in general, I believe the thermal framework has to cover for signed temperature values, even if typical usage is on positive temperature range. Mainly for correct temperature representation. 3. Your documentation (thermal.txt) seems to suggest that the 'cooling-attachments' are one of the required properties for 'thermal-zones' node in the device tree binding files. However, I don't Hmm... That was not the intention. have any cooling device ready in my current patch series yet and therefore I tried to leave out the 'cooling-attachments' node from the 'thermal-zones' node. It seems to be working just find and I can register the sensor and read out the temperature once the target platform has been booted up. Is this your expectation that people can leave the 'cooling-attachments' node out?I want to make sure I can still submit a new patch set for this series with just the functionality of reading out the temperature from the thermal sensor. So, let me try to clarify a couple of things. First thing is that the cooling-attachments has been renamed to cooling-maps, just a new naming convention. Also, there are thermal zones that do not have cooling-maps, they just describe thermal shutdown by software, thermal zones with only CRITICAL trip points, for instance. For this reason, thermal zones must be probed properly without cooling-maps. I need to double check the documentation in this case, I believe. Just to clarify a bit, this does not mean we should allow having thermal zones only for monitoring. If you are generating a thermal zone, it means you want to cover thermal limits. The example I gave was a thermal zone that does not have cooling-maps, but it does have a thermal constraint, a trip point which is CRITICAL, meaning, the silicon state is not reliable anymore. Hi Eduardo, Thanks for your clarification.Yes, there are thermal limits that I need to specify through the trip points. The issue I am facing is that I don't have the cooling device that needs to be associated with the trip point in this patch series yet. I was hoping to get the thermal sensor driver code into the mainline first. The addition for the cooling device and the "cooling-maps" node will be added in another patch series. Since this patch series is now gated by your work, I am wondering if you are targeting to get your patch series (http://lkml.org/lkml/2013/9/15/122) into 3.13? I would like to get an idea of the timeline such that I can plan out my work as well. Thanks! Thanks, -Wendy On 9/23/2013 4:46 PM, Eduardo Valentin wrote: On 23-09-2013 18:43, Wendy Ng wrote: On 9/23/2013 11:19 AM, Eduardo Valentin wrote: On 23-09-2013 13:51, Wendy Ng wrote: This adds the support for reading out temperature from Broadcom bcm281xx SoCs.
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 07-10-2013 10:52, Eduardo Valentin wrote: > On 04-10-2013 18:17, Wendy Ng wrote: >> Hello Eduardo, >> > > Hello Wendy, > >> I have rebased my work on the top of yours and tried out the new way of >> registering the thermal zone.The new method is certainly making >> things easier for me to create a new thermal zone device driver. But I >> have some questions and I hope to hear back from you before I upload my >> new patch set that is based on your changes. > > Great that you gave it a shot. Thanks for that. > >> >> 1. I found that the hwmon sysfs interface is no longer created when I >> call thermal_zone_of_sensor_register() to register my thermal sensor. I >> believe it is because you purposely hard-coded 'no_hwmon' to true. >> Would it be possible to let the users to control this option as part of >> the sensor register function? > > Hmmm.. I also thought of allowing the thermal to hwmon interface > configurable. But the interface gets created in different path from the > sensor registration, which makes things a bit harder. The zones are > probed while parsing the DT file. While the sensors get linked, > thermal_zone_of_sensor_register(), typically when sensors are probed. > > Do you have a real use case for using the thermal to hwmon interface? > Durgadoss (original author) and Rui were considering deprecating and > finally removing it. If yes, it is time to rise your voice here. > >> >> 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned >> value in order to conforms with the thermal framework 'get_temp' >> function prototype. But the new sensor interface 'get_temp' callback >> function (defined in __thermal_zone struct) expects 'temp' to be >> signed. So technically, a negative value can be returned from the >> underlying sensor function. Should some checks be added to >> of_thermal_get_temp() to ensure that a negative value (i.e. a very large >> unsigned value) won't be passed back to the thermal framework? Or >> should the 'get_temp' function prototype in __thermal_zone struct be >> changed with 'unsigned' temperature value and it will be the >> responsibility of the underlying function to do the check? >> > > I could for sure, add a warning inside of_thermal_get_temp(). But in > general, I believe the thermal framework has to cover for signed > temperature values, even if typical usage is on positive temperature > range. Mainly for correct temperature representation. > > >> 3. Your documentation (thermal.txt) seems to suggest that the >> 'cooling-attachments' are one of the required properties for >> 'thermal-zones' node in the device tree binding files. However, I don't > > Hmm... That was not the intention. > >> have any cooling device ready in my current patch series yet and >> therefore I tried to leave out the 'cooling-attachments' node from the >> 'thermal-zones' node. It seems to be working just find and I can >> register the sensor and read out the temperature once the target >> platform has been booted up. Is this your expectation that people can >> leave the 'cooling-attachments' node out?I want to make sure I can >> still submit a new patch set for this series with just the functionality >> of reading out the temperature from the thermal sensor. > > So, let me try to clarify a couple of things. First thing is that the > cooling-attachments has been renamed to cooling-maps, just a new naming > convention. Also, there are thermal zones that do not have > cooling-maps, they just describe thermal shutdown by software, thermal > zones with only CRITICAL trip points, for instance. For this reason, > thermal zones must be probed properly without cooling-maps. I need to > double check the documentation in this case, I believe. Just to clarify a bit, this does not mean we should allow having thermal zones only for monitoring. If you are generating a thermal zone, it means you want to cover thermal limits. The example I gave was a thermal zone that does not have cooling-maps, but it does have a thermal constraint, a trip point which is CRITICAL, meaning, the silicon state is not reliable anymore. > >> >> Thanks, >> -Wendy >> >> On 9/23/2013 4:46 PM, Eduardo Valentin wrote: >>> On 23-09-2013 18:43, Wendy Ng wrote: On 9/23/2013 11:19 AM, Eduardo Valentin wrote: > On 23-09-2013 13:51, Wendy Ng wrote: >> This adds the support for reading out temperature from Broadcom >> bcm281xx >> SoCs. >> >> Signed-off-by: Wendy Ng >> Reviewed-by: Markus Mayer >> Reviewed-by: Christian Daudt >> --- >>.../bindings/thermal/bcm-kona-thermal.txt | 18 +++ >>drivers/thermal/Kconfig| 10 ++ >>drivers/thermal/Makefile |1 + >>drivers/thermal/bcm_thermal.c | 170 >> >>4 files changed, 199 insertions(+) >>create mode 100644 >>
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 04-10-2013 18:17, Wendy Ng wrote: > Hello Eduardo, > Hello Wendy, > I have rebased my work on the top of yours and tried out the new way of > registering the thermal zone.The new method is certainly making > things easier for me to create a new thermal zone device driver. But I > have some questions and I hope to hear back from you before I upload my > new patch set that is based on your changes. Great that you gave it a shot. Thanks for that. > > 1. I found that the hwmon sysfs interface is no longer created when I > call thermal_zone_of_sensor_register() to register my thermal sensor. I > believe it is because you purposely hard-coded 'no_hwmon' to true. > Would it be possible to let the users to control this option as part of > the sensor register function? Hmmm.. I also thought of allowing the thermal to hwmon interface configurable. But the interface gets created in different path from the sensor registration, which makes things a bit harder. The zones are probed while parsing the DT file. While the sensors get linked, thermal_zone_of_sensor_register(), typically when sensors are probed. Do you have a real use case for using the thermal to hwmon interface? Durgadoss (original author) and Rui were considering deprecating and finally removing it. If yes, it is time to rise your voice here. > > 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned > value in order to conforms with the thermal framework 'get_temp' > function prototype. But the new sensor interface 'get_temp' callback > function (defined in __thermal_zone struct) expects 'temp' to be > signed. So technically, a negative value can be returned from the > underlying sensor function. Should some checks be added to > of_thermal_get_temp() to ensure that a negative value (i.e. a very large > unsigned value) won't be passed back to the thermal framework? Or > should the 'get_temp' function prototype in __thermal_zone struct be > changed with 'unsigned' temperature value and it will be the > responsibility of the underlying function to do the check? > I could for sure, add a warning inside of_thermal_get_temp(). But in general, I believe the thermal framework has to cover for signed temperature values, even if typical usage is on positive temperature range. Mainly for correct temperature representation. > 3. Your documentation (thermal.txt) seems to suggest that the > 'cooling-attachments' are one of the required properties for > 'thermal-zones' node in the device tree binding files. However, I don't Hmm... That was not the intention. > have any cooling device ready in my current patch series yet and > therefore I tried to leave out the 'cooling-attachments' node from the > 'thermal-zones' node. It seems to be working just find and I can > register the sensor and read out the temperature once the target > platform has been booted up. Is this your expectation that people can > leave the 'cooling-attachments' node out?I want to make sure I can > still submit a new patch set for this series with just the functionality > of reading out the temperature from the thermal sensor. So, let me try to clarify a couple of things. First thing is that the cooling-attachments has been renamed to cooling-maps, just a new naming convention. Also, there are thermal zones that do not have cooling-maps, they just describe thermal shutdown by software, thermal zones with only CRITICAL trip points, for instance. For this reason, thermal zones must be probed properly without cooling-maps. I need to double check the documentation in this case, I believe. > > Thanks, > -Wendy > > On 9/23/2013 4:46 PM, Eduardo Valentin wrote: >> On 23-09-2013 18:43, Wendy Ng wrote: >>> On 9/23/2013 11:19 AM, Eduardo Valentin wrote: On 23-09-2013 13:51, Wendy Ng wrote: > This adds the support for reading out temperature from Broadcom > bcm281xx > SoCs. > > Signed-off-by: Wendy Ng > Reviewed-by: Markus Mayer > Reviewed-by: Christian Daudt > --- >.../bindings/thermal/bcm-kona-thermal.txt | 18 +++ >drivers/thermal/Kconfig| 10 ++ >drivers/thermal/Makefile |1 + >drivers/thermal/bcm_thermal.c | 170 > >4 files changed, 199 insertions(+) >create mode 100644 > Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt >create mode 100644 drivers/thermal/bcm_thermal.c > > diff --git > a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt > b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt > new file mode 100644 > index 000..acca99e > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt > @@ -0,0 +1,18 @@ > +* Broadcom Kona Thermal Management Unit > + > +This version is for the BCM281xx family of SoCs. > + >
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 04-10-2013 18:17, Wendy Ng wrote: Hello Eduardo, Hello Wendy, I have rebased my work on the top of yours and tried out the new way of registering the thermal zone.The new method is certainly making things easier for me to create a new thermal zone device driver. But I have some questions and I hope to hear back from you before I upload my new patch set that is based on your changes. Great that you gave it a shot. Thanks for that. 1. I found that the hwmon sysfs interface is no longer created when I call thermal_zone_of_sensor_register() to register my thermal sensor. I believe it is because you purposely hard-coded 'no_hwmon' to true. Would it be possible to let the users to control this option as part of the sensor register function? Hmmm.. I also thought of allowing the thermal to hwmon interface configurable. But the interface gets created in different path from the sensor registration, which makes things a bit harder. The zones are probed while parsing the DT file. While the sensors get linked, thermal_zone_of_sensor_register(), typically when sensors are probed. Do you have a real use case for using the thermal to hwmon interface? Durgadoss (original author) and Rui were considering deprecating and finally removing it. If yes, it is time to rise your voice here. 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned value in order to conforms with the thermal framework 'get_temp' function prototype. But the new sensor interface 'get_temp' callback function (defined in __thermal_zone struct) expects 'temp' to be signed. So technically, a negative value can be returned from the underlying sensor function. Should some checks be added to of_thermal_get_temp() to ensure that a negative value (i.e. a very large unsigned value) won't be passed back to the thermal framework? Or should the 'get_temp' function prototype in __thermal_zone struct be changed with 'unsigned' temperature value and it will be the responsibility of the underlying function to do the check? I could for sure, add a warning inside of_thermal_get_temp(). But in general, I believe the thermal framework has to cover for signed temperature values, even if typical usage is on positive temperature range. Mainly for correct temperature representation. 3. Your documentation (thermal.txt) seems to suggest that the 'cooling-attachments' are one of the required properties for 'thermal-zones' node in the device tree binding files. However, I don't Hmm... That was not the intention. have any cooling device ready in my current patch series yet and therefore I tried to leave out the 'cooling-attachments' node from the 'thermal-zones' node. It seems to be working just find and I can register the sensor and read out the temperature once the target platform has been booted up. Is this your expectation that people can leave the 'cooling-attachments' node out?I want to make sure I can still submit a new patch set for this series with just the functionality of reading out the temperature from the thermal sensor. So, let me try to clarify a couple of things. First thing is that the cooling-attachments has been renamed to cooling-maps, just a new naming convention. Also, there are thermal zones that do not have cooling-maps, they just describe thermal shutdown by software, thermal zones with only CRITICAL trip points, for instance. For this reason, thermal zones must be probed properly without cooling-maps. I need to double check the documentation in this case, I believe. Thanks, -Wendy On 9/23/2013 4:46 PM, Eduardo Valentin wrote: On 23-09-2013 18:43, Wendy Ng wrote: On 9/23/2013 11:19 AM, Eduardo Valentin wrote: On 23-09-2013 13:51, Wendy Ng wrote: This adds the support for reading out temperature from Broadcom bcm281xx SoCs. Signed-off-by: Wendy Ng wendy...@broadcom.com Reviewed-by: Markus Mayer mma...@broadcom.com Reviewed-by: Christian Daudt c...@broadcom.com --- .../bindings/thermal/bcm-kona-thermal.txt | 18 +++ drivers/thermal/Kconfig| 10 ++ drivers/thermal/Makefile |1 + drivers/thermal/bcm_thermal.c | 170 4 files changed, 199 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt create mode 100644 drivers/thermal/bcm_thermal.c diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt new file mode 100644 index 000..acca99e --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt @@ -0,0 +1,18 @@ +* Broadcom Kona Thermal Management Unit + +This version is for the BCM281xx family of SoCs. + +Required properties: +- compatible : brcm,bcm11351-thermal, brcm,kona-thermal +- reg : Address range of the thermal register +- thermal-name: this
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 07-10-2013 10:52, Eduardo Valentin wrote: On 04-10-2013 18:17, Wendy Ng wrote: Hello Eduardo, Hello Wendy, I have rebased my work on the top of yours and tried out the new way of registering the thermal zone.The new method is certainly making things easier for me to create a new thermal zone device driver. But I have some questions and I hope to hear back from you before I upload my new patch set that is based on your changes. Great that you gave it a shot. Thanks for that. 1. I found that the hwmon sysfs interface is no longer created when I call thermal_zone_of_sensor_register() to register my thermal sensor. I believe it is because you purposely hard-coded 'no_hwmon' to true. Would it be possible to let the users to control this option as part of the sensor register function? Hmmm.. I also thought of allowing the thermal to hwmon interface configurable. But the interface gets created in different path from the sensor registration, which makes things a bit harder. The zones are probed while parsing the DT file. While the sensors get linked, thermal_zone_of_sensor_register(), typically when sensors are probed. Do you have a real use case for using the thermal to hwmon interface? Durgadoss (original author) and Rui were considering deprecating and finally removing it. If yes, it is time to rise your voice here. 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned value in order to conforms with the thermal framework 'get_temp' function prototype. But the new sensor interface 'get_temp' callback function (defined in __thermal_zone struct) expects 'temp' to be signed. So technically, a negative value can be returned from the underlying sensor function. Should some checks be added to of_thermal_get_temp() to ensure that a negative value (i.e. a very large unsigned value) won't be passed back to the thermal framework? Or should the 'get_temp' function prototype in __thermal_zone struct be changed with 'unsigned' temperature value and it will be the responsibility of the underlying function to do the check? I could for sure, add a warning inside of_thermal_get_temp(). But in general, I believe the thermal framework has to cover for signed temperature values, even if typical usage is on positive temperature range. Mainly for correct temperature representation. 3. Your documentation (thermal.txt) seems to suggest that the 'cooling-attachments' are one of the required properties for 'thermal-zones' node in the device tree binding files. However, I don't Hmm... That was not the intention. have any cooling device ready in my current patch series yet and therefore I tried to leave out the 'cooling-attachments' node from the 'thermal-zones' node. It seems to be working just find and I can register the sensor and read out the temperature once the target platform has been booted up. Is this your expectation that people can leave the 'cooling-attachments' node out?I want to make sure I can still submit a new patch set for this series with just the functionality of reading out the temperature from the thermal sensor. So, let me try to clarify a couple of things. First thing is that the cooling-attachments has been renamed to cooling-maps, just a new naming convention. Also, there are thermal zones that do not have cooling-maps, they just describe thermal shutdown by software, thermal zones with only CRITICAL trip points, for instance. For this reason, thermal zones must be probed properly without cooling-maps. I need to double check the documentation in this case, I believe. Just to clarify a bit, this does not mean we should allow having thermal zones only for monitoring. If you are generating a thermal zone, it means you want to cover thermal limits. The example I gave was a thermal zone that does not have cooling-maps, but it does have a thermal constraint, a trip point which is CRITICAL, meaning, the silicon state is not reliable anymore. Thanks, -Wendy On 9/23/2013 4:46 PM, Eduardo Valentin wrote: On 23-09-2013 18:43, Wendy Ng wrote: On 9/23/2013 11:19 AM, Eduardo Valentin wrote: On 23-09-2013 13:51, Wendy Ng wrote: This adds the support for reading out temperature from Broadcom bcm281xx SoCs. Signed-off-by: Wendy Ng wendy...@broadcom.com Reviewed-by: Markus Mayer mma...@broadcom.com Reviewed-by: Christian Daudt c...@broadcom.com --- .../bindings/thermal/bcm-kona-thermal.txt | 18 +++ drivers/thermal/Kconfig| 10 ++ drivers/thermal/Makefile |1 + drivers/thermal/bcm_thermal.c | 170 4 files changed, 199 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt create mode 100644 drivers/thermal/bcm_thermal.c diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 10/7/2013 9:12 AM, Eduardo Valentin wrote: On 07-10-2013 10:52, Eduardo Valentin wrote: On 04-10-2013 18:17, Wendy Ng wrote: Hello Eduardo, Hello Wendy, I have rebased my work on the top of yours and tried out the new way of registering the thermal zone.The new method is certainly making things easier for me to create a new thermal zone device driver. But I have some questions and I hope to hear back from you before I upload my new patch set that is based on your changes. Great that you gave it a shot. Thanks for that. 1. I found that the hwmon sysfs interface is no longer created when I call thermal_zone_of_sensor_register() to register my thermal sensor. I believe it is because you purposely hard-coded 'no_hwmon' to true. Would it be possible to let the users to control this option as part of the sensor register function? Hmmm.. I also thought of allowing the thermal to hwmon interface configurable. But the interface gets created in different path from the sensor registration, which makes things a bit harder. The zones are probed while parsing the DT file. While the sensors get linked, thermal_zone_of_sensor_register(), typically when sensors are probed. Do you have a real use case for using the thermal to hwmon interface? Durgadoss (original author) and Rui were considering deprecating and finally removing it. If yes, it is time to rise your voice here. 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned value in order to conforms with the thermal framework 'get_temp' function prototype. But the new sensor interface 'get_temp' callback function (defined in __thermal_zone struct) expects 'temp' to be signed. So technically, a negative value can be returned from the underlying sensor function. Should some checks be added to of_thermal_get_temp() to ensure that a negative value (i.e. a very large unsigned value) won't be passed back to the thermal framework? Or should the 'get_temp' function prototype in __thermal_zone struct be changed with 'unsigned' temperature value and it will be the responsibility of the underlying function to do the check? I could for sure, add a warning inside of_thermal_get_temp(). But in general, I believe the thermal framework has to cover for signed temperature values, even if typical usage is on positive temperature range. Mainly for correct temperature representation. 3. Your documentation (thermal.txt) seems to suggest that the 'cooling-attachments' are one of the required properties for 'thermal-zones' node in the device tree binding files. However, I don't Hmm... That was not the intention. have any cooling device ready in my current patch series yet and therefore I tried to leave out the 'cooling-attachments' node from the 'thermal-zones' node. It seems to be working just find and I can register the sensor and read out the temperature once the target platform has been booted up. Is this your expectation that people can leave the 'cooling-attachments' node out?I want to make sure I can still submit a new patch set for this series with just the functionality of reading out the temperature from the thermal sensor. So, let me try to clarify a couple of things. First thing is that the cooling-attachments has been renamed to cooling-maps, just a new naming convention. Also, there are thermal zones that do not have cooling-maps, they just describe thermal shutdown by software, thermal zones with only CRITICAL trip points, for instance. For this reason, thermal zones must be probed properly without cooling-maps. I need to double check the documentation in this case, I believe. Just to clarify a bit, this does not mean we should allow having thermal zones only for monitoring. If you are generating a thermal zone, it means you want to cover thermal limits. The example I gave was a thermal zone that does not have cooling-maps, but it does have a thermal constraint, a trip point which is CRITICAL, meaning, the silicon state is not reliable anymore. Hi Eduardo, Thanks for your clarification.Yes, there are thermal limits that I need to specify through the trip points. The issue I am facing is that I don't have the cooling device that needs to be associated with the trip point in this patch series yet. I was hoping to get the thermal sensor driver code into the mainline first. The addition for the cooling device and the cooling-maps node will be added in another patch series. Since this patch series is now gated by your work, I am wondering if you are targeting to get your patch series (http://lkml.org/lkml/2013/9/15/122) into 3.13? I would like to get an idea of the timeline such that I can plan out my work as well. Thanks! Thanks, -Wendy On 9/23/2013 4:46 PM, Eduardo Valentin wrote: On 23-09-2013 18:43, Wendy Ng wrote: On 9/23/2013 11:19 AM, Eduardo Valentin wrote: On 23-09-2013 13:51, Wendy Ng wrote: This adds the support for reading out temperature from Broadcom bcm281xx SoCs.
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 07-10-2013 13:52, Wendy Ng wrote: On 10/7/2013 9:12 AM, Eduardo Valentin wrote: On 07-10-2013 10:52, Eduardo Valentin wrote: On 04-10-2013 18:17, Wendy Ng wrote: Hello Eduardo, Hello Wendy, I have rebased my work on the top of yours and tried out the new way of registering the thermal zone.The new method is certainly making things easier for me to create a new thermal zone device driver. But I have some questions and I hope to hear back from you before I upload my new patch set that is based on your changes. Great that you gave it a shot. Thanks for that. 1. I found that the hwmon sysfs interface is no longer created when I call thermal_zone_of_sensor_register() to register my thermal sensor. I believe it is because you purposely hard-coded 'no_hwmon' to true. Would it be possible to let the users to control this option as part of the sensor register function? Hmmm.. I also thought of allowing the thermal to hwmon interface configurable. But the interface gets created in different path from the sensor registration, which makes things a bit harder. The zones are probed while parsing the DT file. While the sensors get linked, thermal_zone_of_sensor_register(), typically when sensors are probed. Do you have a real use case for using the thermal to hwmon interface? Durgadoss (original author) and Rui were considering deprecating and finally removing it. If yes, it is time to rise your voice here. 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned value in order to conforms with the thermal framework 'get_temp' function prototype. But the new sensor interface 'get_temp' callback function (defined in __thermal_zone struct) expects 'temp' to be signed. So technically, a negative value can be returned from the underlying sensor function. Should some checks be added to of_thermal_get_temp() to ensure that a negative value (i.e. a very large unsigned value) won't be passed back to the thermal framework? Or should the 'get_temp' function prototype in __thermal_zone struct be changed with 'unsigned' temperature value and it will be the responsibility of the underlying function to do the check? I could for sure, add a warning inside of_thermal_get_temp(). But in general, I believe the thermal framework has to cover for signed temperature values, even if typical usage is on positive temperature range. Mainly for correct temperature representation. 3. Your documentation (thermal.txt) seems to suggest that the 'cooling-attachments' are one of the required properties for 'thermal-zones' node in the device tree binding files. However, I don't Hmm... That was not the intention. have any cooling device ready in my current patch series yet and therefore I tried to leave out the 'cooling-attachments' node from the 'thermal-zones' node. It seems to be working just find and I can register the sensor and read out the temperature once the target platform has been booted up. Is this your expectation that people can leave the 'cooling-attachments' node out?I want to make sure I can still submit a new patch set for this series with just the functionality of reading out the temperature from the thermal sensor. So, let me try to clarify a couple of things. First thing is that the cooling-attachments has been renamed to cooling-maps, just a new naming convention. Also, there are thermal zones that do not have cooling-maps, they just describe thermal shutdown by software, thermal zones with only CRITICAL trip points, for instance. For this reason, thermal zones must be probed properly without cooling-maps. I need to double check the documentation in this case, I believe. Just to clarify a bit, this does not mean we should allow having thermal zones only for monitoring. If you are generating a thermal zone, it means you want to cover thermal limits. The example I gave was a thermal zone that does not have cooling-maps, but it does have a thermal constraint, a trip point which is CRITICAL, meaning, the silicon state is not reliable anymore. Hi Eduardo, Thanks for your clarification.Yes, there are thermal limits that I need to specify through the trip points. The issue I am facing is that I don't have the cooling device that needs to be associated with the trip point in this patch series yet. I was hoping to get the thermal sensor driver code into the mainline first. The addition for the cooling device and the cooling-maps node will be added in another patch series. Wendy, Let me try to understand it properly. What cooling device is missing? Is it only the kernel code or the its DT bindings too? Does it prevent you to define the bindings? I believe it should be fine to have the bindings without the kernel code (as long as the bindings are correct). I have also tried this patch series on top of a systems with missing cpufreq support. That means, I had all the thermal bindings, but the cooling device was not
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 10/7/2013 3:32 PM, Eduardo Valentin wrote: On 07-10-2013 13:52, Wendy Ng wrote: On 10/7/2013 9:12 AM, Eduardo Valentin wrote: On 07-10-2013 10:52, Eduardo Valentin wrote: On 04-10-2013 18:17, Wendy Ng wrote: Hello Eduardo, Hello Wendy, I have rebased my work on the top of yours and tried out the new way of registering the thermal zone.The new method is certainly making things easier for me to create a new thermal zone device driver. But I have some questions and I hope to hear back from you before I upload my new patch set that is based on your changes. Great that you gave it a shot. Thanks for that. 1. I found that the hwmon sysfs interface is no longer created when I call thermal_zone_of_sensor_register() to register my thermal sensor. I believe it is because you purposely hard-coded 'no_hwmon' to true. Would it be possible to let the users to control this option as part of the sensor register function? Hmmm.. I also thought of allowing the thermal to hwmon interface configurable. But the interface gets created in different path from the sensor registration, which makes things a bit harder. The zones are probed while parsing the DT file. While the sensors get linked, thermal_zone_of_sensor_register(), typically when sensors are probed. Do you have a real use case for using the thermal to hwmon interface? Durgadoss (original author) and Rui were considering deprecating and finally removing it. If yes, it is time to rise your voice here. 2. The of_thermal_get_temp() output parameter 'temp' is an unsigned value in order to conforms with the thermal framework 'get_temp' function prototype. But the new sensor interface 'get_temp' callback function (defined in __thermal_zone struct) expects 'temp' to be signed. So technically, a negative value can be returned from the underlying sensor function. Should some checks be added to of_thermal_get_temp() to ensure that a negative value (i.e. a very large unsigned value) won't be passed back to the thermal framework? Or should the 'get_temp' function prototype in __thermal_zone struct be changed with 'unsigned' temperature value and it will be the responsibility of the underlying function to do the check? I could for sure, add a warning inside of_thermal_get_temp(). But in general, I believe the thermal framework has to cover for signed temperature values, even if typical usage is on positive temperature range. Mainly for correct temperature representation. 3. Your documentation (thermal.txt) seems to suggest that the 'cooling-attachments' are one of the required properties for 'thermal-zones' node in the device tree binding files. However, I don't Hmm... That was not the intention. have any cooling device ready in my current patch series yet and therefore I tried to leave out the 'cooling-attachments' node from the 'thermal-zones' node. It seems to be working just find and I can register the sensor and read out the temperature once the target platform has been booted up. Is this your expectation that people can leave the 'cooling-attachments' node out?I want to make sure I can still submit a new patch set for this series with just the functionality of reading out the temperature from the thermal sensor. So, let me try to clarify a couple of things. First thing is that the cooling-attachments has been renamed to cooling-maps, just a new naming convention. Also, there are thermal zones that do not have cooling-maps, they just describe thermal shutdown by software, thermal zones with only CRITICAL trip points, for instance. For this reason, thermal zones must be probed properly without cooling-maps. I need to double check the documentation in this case, I believe. Just to clarify a bit, this does not mean we should allow having thermal zones only for monitoring. If you are generating a thermal zone, it means you want to cover thermal limits. The example I gave was a thermal zone that does not have cooling-maps, but it does have a thermal constraint, a trip point which is CRITICAL, meaning, the silicon state is not reliable anymore. Hi Eduardo, Thanks for your clarification.Yes, there are thermal limits that I need to specify through the trip points. The issue I am facing is that I don't have the cooling device that needs to be associated with the trip point in this patch series yet. I was hoping to get the thermal sensor driver code into the mainline first. The addition for the cooling device and the cooling-maps node will be added in another patch series. Wendy, Let me try to understand it properly. What cooling device is missing? Is it only the kernel code or the its DT bindings too? Does it prevent you to define the bindings? I believe it should be fine to have the bindings without the kernel code (as long as the bindings are correct). I have also tried this patch series on top of a systems with missing cpufreq support. That means, I had all the thermal bindings, but the cooling device was not loaded in
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
Hello Eduardo,
I have rebased my work on the top of yours and tried out the new way of
registering the thermal zone.The new method is certainly making
things easier for me to create a new thermal zone device driver. But I
have some questions and I hope to hear back from you before I upload my
new patch set that is based on your changes.
1. I found that the hwmon sysfs interface is no longer created when I
call thermal_zone_of_sensor_register() to register my thermal sensor. I
believe it is because you purposely hard-coded 'no_hwmon' to true.
Would it be possible to let the users to control this option as part of
the sensor register function?
2. The of_thermal_get_temp() output parameter 'temp' is an unsigned
value in order to conforms with the thermal framework 'get_temp'
function prototype. But the new sensor interface 'get_temp' callback
function (defined in __thermal_zone struct) expects 'temp' to be
signed. So technically, a negative value can be returned from the
underlying sensor function. Should some checks be added to
of_thermal_get_temp() to ensure that a negative value (i.e. a very large
unsigned value) won't be passed back to the thermal framework? Or
should the 'get_temp' function prototype in __thermal_zone struct be
changed with 'unsigned' temperature value and it will be the
responsibility of the underlying function to do the check?
3. Your documentation (thermal.txt) seems to suggest that the
'cooling-attachments' are one of the required properties for
'thermal-zones' node in the device tree binding files. However, I don't
have any cooling device ready in my current patch series yet and
therefore I tried to leave out the 'cooling-attachments' node from the
'thermal-zones' node. It seems to be working just find and I can
register the sensor and read out the temperature once the target
platform has been booted up. Is this your expectation that people can
leave the 'cooling-attachments' node out?I want to make sure I can
still submit a new patch set for this series with just the functionality
of reading out the temperature from the thermal sensor.
Thanks,
-Wendy
On 9/23/2013 4:46 PM, Eduardo Valentin wrote:
On 23-09-2013 18:43, Wendy Ng wrote:
On 9/23/2013 11:19 AM, Eduardo Valentin wrote:
On 23-09-2013 13:51, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng
Reviewed-by: Markus Mayer
Reviewed-by: Christian Daudt
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git
a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : "brcm,bcm11351-thermal", "brcm,kona-thermal"
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported
under Hwmon
+sysfs 'name' attribute.
+
+Example:
+thermal@34008000 {
+compatible = "brcm,bcm11351-thermal", "brcm,kona-thermal";
+reg = <0x34008000 0x0024>;
+thermal-name = "bcm_kona_therm";
+status = "disabled";
+};
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux
thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+tristate "Temperature sensor on Broadcom BCM281xx family of SoCs"
+depends on ARCH_BCM
+default y
+help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
+
config DOVE_THERMAL
tristate "Temperature sensor on Marvell Dove SoCs"
depends on ARCH_DOVE
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 584b363..3ea8c1c 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -21,6 +21,7 @@ obj-$(CONFIG_SPEAR_THERMAL)+= spear_thermal.o
obj-$(CONFIG_RCAR_THERMAL)+=
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
Hello Eduardo,
I have rebased my work on the top of yours and tried out the new way of
registering the thermal zone.The new method is certainly making
things easier for me to create a new thermal zone device driver. But I
have some questions and I hope to hear back from you before I upload my
new patch set that is based on your changes.
1. I found that the hwmon sysfs interface is no longer created when I
call thermal_zone_of_sensor_register() to register my thermal sensor. I
believe it is because you purposely hard-coded 'no_hwmon' to true.
Would it be possible to let the users to control this option as part of
the sensor register function?
2. The of_thermal_get_temp() output parameter 'temp' is an unsigned
value in order to conforms with the thermal framework 'get_temp'
function prototype. But the new sensor interface 'get_temp' callback
function (defined in __thermal_zone struct) expects 'temp' to be
signed. So technically, a negative value can be returned from the
underlying sensor function. Should some checks be added to
of_thermal_get_temp() to ensure that a negative value (i.e. a very large
unsigned value) won't be passed back to the thermal framework? Or
should the 'get_temp' function prototype in __thermal_zone struct be
changed with 'unsigned' temperature value and it will be the
responsibility of the underlying function to do the check?
3. Your documentation (thermal.txt) seems to suggest that the
'cooling-attachments' are one of the required properties for
'thermal-zones' node in the device tree binding files. However, I don't
have any cooling device ready in my current patch series yet and
therefore I tried to leave out the 'cooling-attachments' node from the
'thermal-zones' node. It seems to be working just find and I can
register the sensor and read out the temperature once the target
platform has been booted up. Is this your expectation that people can
leave the 'cooling-attachments' node out?I want to make sure I can
still submit a new patch set for this series with just the functionality
of reading out the temperature from the thermal sensor.
Thanks,
-Wendy
On 9/23/2013 4:46 PM, Eduardo Valentin wrote:
On 23-09-2013 18:43, Wendy Ng wrote:
On 9/23/2013 11:19 AM, Eduardo Valentin wrote:
On 23-09-2013 13:51, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng wendy...@broadcom.com
Reviewed-by: Markus Mayer mma...@broadcom.com
Reviewed-by: Christian Daudt c...@broadcom.com
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git
a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : brcm,bcm11351-thermal, brcm,kona-thermal
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported
under Hwmon
+sysfs 'name' attribute.
+
+Example:
+thermal@34008000 {
+compatible = brcm,bcm11351-thermal, brcm,kona-thermal;
+reg = 0x34008000 0x0024;
+thermal-name = bcm_kona_therm;
+status = disabled;
+};
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux
thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+tristate Temperature sensor on Broadcom BCM281xx family of SoCs
+depends on ARCH_BCM
+default y
+help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
+
config DOVE_THERMAL
tristate Temperature sensor on Marvell Dove SoCs
depends on ARCH_DOVE
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 584b363..3ea8c1c 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -21,6 +21,7 @@ obj-$(CONFIG_SPEAR_THERMAL)+= spear_thermal.o
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 9/25/2013 12:26 PM, Matt Porter wrote:
On Mon, Sep 23, 2013 at 10:51:36AM -0700, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng
Reviewed-by: Markus Mayer
Reviewed-by: Christian Daudt
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : "brcm,bcm11351-thermal", "brcm,kona-thermal"
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported under Hwmon
+sysfs 'name' attribute.
+
+Example:
+ thermal@34008000 {
+ compatible = "brcm,bcm11351-thermal", "brcm,kona-thermal";
+ reg = <0x34008000 0x0024>;
+ thermal-name = "bcm_kona_therm";
+ status = "disabled";
+ };
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+ tristate "Temperature sensor on Broadcom BCM281xx family of SoCs"
+ depends on ARCH_BCM
Hi Wendy,
I just noticed that, depending on acceptance, this could collide with
Christian's ARCH_BCM->ARCH_BCM_MOBILE rename that is expected to go into
3.13. I'm not sure if this series is targeted for 3.13 (due to the discussion
about Eduardo's subsystem changes that impact it). If it is, you might
want to rebase on Christian's rename series
http://www.spinics.net/lists/arm-kernel/msg274963.html and use
ARCH_BCM_MOBILE here.
-Matt
Hi Matt,
I have uploaded v2 of this thermal driver patch series to make it
compatible with Christian's
ARCH_BCM->ARCH_BCM_MOBILE changes.
Thanks for pointing this out!
+ default y
+ help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
--
Best regards,
-Wendy
--
To unsubscribe from this list: send the line "unsubscribe linux-kernel" in
the body of a message to majord...@vger.kernel.org
More majordomo info at http://vger.kernel.org/majordomo-info.html
Please read the FAQ at http://www.tux.org/lkml/
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 9/25/2013 12:26 PM, Matt Porter wrote:
On Mon, Sep 23, 2013 at 10:51:36AM -0700, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng wendy...@broadcom.com
Reviewed-by: Markus Mayer mma...@broadcom.com
Reviewed-by: Christian Daudt c...@broadcom.com
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : brcm,bcm11351-thermal, brcm,kona-thermal
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported under Hwmon
+sysfs 'name' attribute.
+
+Example:
+ thermal@34008000 {
+ compatible = brcm,bcm11351-thermal, brcm,kona-thermal;
+ reg = 0x34008000 0x0024;
+ thermal-name = bcm_kona_therm;
+ status = disabled;
+ };
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+ tristate Temperature sensor on Broadcom BCM281xx family of SoCs
+ depends on ARCH_BCM
Hi Wendy,
I just noticed that, depending on acceptance, this could collide with
Christian's ARCH_BCM-ARCH_BCM_MOBILE rename that is expected to go into
3.13. I'm not sure if this series is targeted for 3.13 (due to the discussion
about Eduardo's subsystem changes that impact it). If it is, you might
want to rebase on Christian's rename series
http://www.spinics.net/lists/arm-kernel/msg274963.html and use
ARCH_BCM_MOBILE here.
-Matt
Hi Matt,
I have uploaded v2 of this thermal driver patch series to make it
compatible with Christian's
ARCH_BCM-ARCH_BCM_MOBILE changes.
Thanks for pointing this out!
+ default y
+ help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
--
Best regards,
-Wendy
--
To unsubscribe from this list: send the line unsubscribe linux-kernel in
the body of a message to majord...@vger.kernel.org
More majordomo info at http://vger.kernel.org/majordomo-info.html
Please read the FAQ at http://www.tux.org/lkml/
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On Mon, Sep 23, 2013 at 10:51:36AM -0700, Wendy Ng wrote:
> This adds the support for reading out temperature from Broadcom bcm281xx
> SoCs.
>
> Signed-off-by: Wendy Ng
> Reviewed-by: Markus Mayer
> Reviewed-by: Christian Daudt
> ---
> .../bindings/thermal/bcm-kona-thermal.txt | 18 +++
> drivers/thermal/Kconfig| 10 ++
> drivers/thermal/Makefile |1 +
> drivers/thermal/bcm_thermal.c | 170
>
> 4 files changed, 199 insertions(+)
> create mode 100644
> Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
> create mode 100644 drivers/thermal/bcm_thermal.c
>
> diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
> b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
> new file mode 100644
> index 000..acca99e
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
> @@ -0,0 +1,18 @@
> +* Broadcom Kona Thermal Management Unit
> +
> +This version is for the BCM281xx family of SoCs.
> +
> +Required properties:
> +- compatible : "brcm,bcm11351-thermal", "brcm,kona-thermal"
> +- reg : Address range of the thermal register
> +- thermal-name: this entry must be specified and it will be passed into
> +thermal_zone_device_register(). This name will also be reported under Hwmon
> +sysfs 'name' attribute.
> +
> +Example:
> + thermal@34008000 {
> + compatible = "brcm,bcm11351-thermal", "brcm,kona-thermal";
> + reg = <0x34008000 0x0024>;
> + thermal-name = "bcm_kona_therm";
> + status = "disabled";
> + };
> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
> index dbfc390..7f823f0 100644
> --- a/drivers/thermal/Kconfig
> +++ b/drivers/thermal/Kconfig
> @@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
> Support for the Kirkwood thermal sensor driver into the Linux thermal
> framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
>
> +config BCM_THERMAL
> + tristate "Temperature sensor on Broadcom BCM281xx family of SoCs"
> + depends on ARCH_BCM
Hi Wendy,
I just noticed that, depending on acceptance, this could collide with
Christian's ARCH_BCM->ARCH_BCM_MOBILE rename that is expected to go into
3.13. I'm not sure if this series is targeted for 3.13 (due to the discussion
about Eduardo's subsystem changes that impact it). If it is, you might
want to rebase on Christian's rename series
http://www.spinics.net/lists/arm-kernel/msg274963.html and use
ARCH_BCM_MOBILE here.
-Matt
> + default y
> + help
> + If you say yes here you get support for TMU (Thermal Management
> + Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
> + monitoring of CPU clusters, graphics, and SoC glue, but does not
> + include monitoring of charger temperature.
--
To unsubscribe from this list: send the line "unsubscribe linux-kernel" in
the body of a message to majord...@vger.kernel.org
More majordomo info at http://vger.kernel.org/majordomo-info.html
Please read the FAQ at http://www.tux.org/lkml/
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On Mon, Sep 23, 2013 at 10:51:36AM -0700, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng wendy...@broadcom.com
Reviewed-by: Markus Mayer mma...@broadcom.com
Reviewed-by: Christian Daudt c...@broadcom.com
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : brcm,bcm11351-thermal, brcm,kona-thermal
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported under Hwmon
+sysfs 'name' attribute.
+
+Example:
+ thermal@34008000 {
+ compatible = brcm,bcm11351-thermal, brcm,kona-thermal;
+ reg = 0x34008000 0x0024;
+ thermal-name = bcm_kona_therm;
+ status = disabled;
+ };
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+ tristate Temperature sensor on Broadcom BCM281xx family of SoCs
+ depends on ARCH_BCM
Hi Wendy,
I just noticed that, depending on acceptance, this could collide with
Christian's ARCH_BCM-ARCH_BCM_MOBILE rename that is expected to go into
3.13. I'm not sure if this series is targeted for 3.13 (due to the discussion
about Eduardo's subsystem changes that impact it). If it is, you might
want to rebase on Christian's rename series
http://www.spinics.net/lists/arm-kernel/msg274963.html and use
ARCH_BCM_MOBILE here.
-Matt
+ default y
+ help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
--
To unsubscribe from this list: send the line unsubscribe linux-kernel in
the body of a message to majord...@vger.kernel.org
More majordomo info at http://vger.kernel.org/majordomo-info.html
Please read the FAQ at http://www.tux.org/lkml/
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 23-09-2013 18:43, Wendy Ng wrote:
>
> On 9/23/2013 11:19 AM, Eduardo Valentin wrote:
>> On 23-09-2013 13:51, Wendy Ng wrote:
>>> This adds the support for reading out temperature from Broadcom bcm281xx
>>> SoCs.
>>>
>>> Signed-off-by: Wendy Ng
>>> Reviewed-by: Markus Mayer
>>> Reviewed-by: Christian Daudt
>>> ---
>>> .../bindings/thermal/bcm-kona-thermal.txt | 18 +++
>>> drivers/thermal/Kconfig| 10 ++
>>> drivers/thermal/Makefile |1 +
>>> drivers/thermal/bcm_thermal.c | 170
>>>
>>> 4 files changed, 199 insertions(+)
>>> create mode 100644
>>> Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
>>> create mode 100644 drivers/thermal/bcm_thermal.c
>>>
>>> diff --git
>>> a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
>>> b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
>>> new file mode 100644
>>> index 000..acca99e
>>> --- /dev/null
>>> +++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
>>> @@ -0,0 +1,18 @@
>>> +* Broadcom Kona Thermal Management Unit
>>> +
>>> +This version is for the BCM281xx family of SoCs.
>>> +
>>> +Required properties:
>>> +- compatible : "brcm,bcm11351-thermal", "brcm,kona-thermal"
>>> +- reg : Address range of the thermal register
>>> +- thermal-name: this entry must be specified and it will be passed into
>>> +thermal_zone_device_register(). This name will also be reported
>>> under Hwmon
>>> +sysfs 'name' attribute.
>>> +
>>> +Example:
>>> +thermal@34008000 {
>>> +compatible = "brcm,bcm11351-thermal", "brcm,kona-thermal";
>>> +reg = <0x34008000 0x0024>;
>>> +thermal-name = "bcm_kona_therm";
>>> +status = "disabled";
>>> +};
>>> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
>>> index dbfc390..7f823f0 100644
>>> --- a/drivers/thermal/Kconfig
>>> +++ b/drivers/thermal/Kconfig
>>> @@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
>>> Support for the Kirkwood thermal sensor driver into the Linux
>>> thermal
>>> framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
>>> +config BCM_THERMAL
>>> +tristate "Temperature sensor on Broadcom BCM281xx family of SoCs"
>>> +depends on ARCH_BCM
>>> +default y
>>> +help
>>> + If you say yes here you get support for TMU (Thermal Management
>>> + Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
>>> + monitoring of CPU clusters, graphics, and SoC glue, but does not
>>> + include monitoring of charger temperature.
>>> +
>>> config DOVE_THERMAL
>>> tristate "Temperature sensor on Marvell Dove SoCs"
>>> depends on ARCH_DOVE
>>> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
>>> index 584b363..3ea8c1c 100644
>>> --- a/drivers/thermal/Makefile
>>> +++ b/drivers/thermal/Makefile
>>> @@ -21,6 +21,7 @@ obj-$(CONFIG_SPEAR_THERMAL)+= spear_thermal.o
>>> obj-$(CONFIG_RCAR_THERMAL)+= rcar_thermal.o
>>> obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
>>> obj-y+= samsung/
>>> +obj-$(CONFIG_BCM_THERMAL) += bcm_thermal.o
>>> obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
>>> obj-$(CONFIG_DB8500_THERMAL)+= db8500_thermal.o
>>> obj-$(CONFIG_ARMADA_THERMAL)+= armada_thermal.o
>>> diff --git a/drivers/thermal/bcm_thermal.c
>>> b/drivers/thermal/bcm_thermal.c
>>> new file mode 100644
>>> index 000..131d3c4
>>> --- /dev/null
>>> +++ b/drivers/thermal/bcm_thermal.c
>>> @@ -0,0 +1,170 @@
>>> +/*
>>> + * Copyright 2013 Broadcom Corporation.
>>> + *
>>> + * This program is free software; you can redistribute it and/or modify
>>> + * it under the terms of the GNU General Public License, version 2,
>>> + * as published by the Free Software Foundation (the "GPL").
>>> + *
>>> + * This program is distributed in the hope that it will be useful,
>>> + * but WITHOUT ANY WARRANTY; without even the implied warranty of
>>> + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
>>> + * GNU General Public License for more details.
>>> + *
>>> + * A copy of the GPL is available at
>>> http://www.broadcom.com/licenses/GPLv2.php,
>>> + * or by writing to the Free Software Foundation, Inc.,
>>> + * 59 Temple Place - Suite 330, Boston, MA 02111-1307, USA.
>>> + */
>>> +
>>> +/**
>>> +* Broadcom Thermal Management Unit - bcm_tmu
>>> +*/
>>> +#include
>>> +#include
>>> +#include
>>> +#include
>>> +#include
>>> +#include
>>> +#include
>>> +
>>> +/* From TMON Register Database */
>>> +#define TMON_TEMP_VAL_OFFSET0x001c
>>> +#define TMON_TEMP_VAL_TEMP_VAL_SHIFT0
>>> +#define TMON_TEMP_VAL_TEMP_VAL_MASK0x03ff
>>> +
>>> +/* Broadcom Thermal Zone Device Structure */
>>> +struct bcm_thermal_zone_priv {
>>> +char name[THERMAL_NAME_LENGTH];
>>> +void __iomem *base;
>>> +};
>>> +
>>> +/* Temperature conversion function for
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 9/23/2013 11:19 AM, Eduardo Valentin wrote:
On 23-09-2013 13:51, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng
Reviewed-by: Markus Mayer
Reviewed-by: Christian Daudt
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : "brcm,bcm11351-thermal", "brcm,kona-thermal"
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported under Hwmon
+sysfs 'name' attribute.
+
+Example:
+ thermal@34008000 {
+ compatible = "brcm,bcm11351-thermal", "brcm,kona-thermal";
+ reg = <0x34008000 0x0024>;
+ thermal-name = "bcm_kona_therm";
+ status = "disabled";
+ };
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+ tristate "Temperature sensor on Broadcom BCM281xx family of SoCs"
+ depends on ARCH_BCM
+ default y
+ help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
+
config DOVE_THERMAL
tristate "Temperature sensor on Marvell Dove SoCs"
depends on ARCH_DOVE
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 584b363..3ea8c1c 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -21,6 +21,7 @@ obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
obj-$(CONFIG_RCAR_THERMAL)+= rcar_thermal.o
obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
obj-y += samsung/
+obj-$(CONFIG_BCM_THERMAL) += bcm_thermal.o
obj-$(CONFIG_DOVE_THERMAL)+= dove_thermal.o
obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
diff --git a/drivers/thermal/bcm_thermal.c b/drivers/thermal/bcm_thermal.c
new file mode 100644
index 000..131d3c4
--- /dev/null
+++ b/drivers/thermal/bcm_thermal.c
@@ -0,0 +1,170 @@
+/*
+ * Copyright 2013 Broadcom Corporation.
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License, version 2,
+ * as published by the Free Software Foundation (the "GPL").
+ *
+ * This program is distributed in the hope that it will be useful,
+ * but WITHOUT ANY WARRANTY; without even the implied warranty of
+ * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
+ * GNU General Public License for more details.
+ *
+ * A copy of the GPL is available at
http://www.broadcom.com/licenses/GPLv2.php,
+ * or by writing to the Free Software Foundation, Inc.,
+ * 59 Temple Place - Suite 330, Boston, MA 02111-1307, USA.
+ */
+
+/**
+* Broadcom Thermal Management Unit - bcm_tmu
+*/
+#include
+#include
+#include
+#include
+#include
+#include
+#include
+
+/* From TMON Register Database */
+#define TMON_TEMP_VAL_OFFSET 0x001c
+#define TMON_TEMP_VAL_TEMP_VAL_SHIFT 0
+#define TMON_TEMP_VAL_TEMP_VAL_MASK0x03ff
+
+/* Broadcom Thermal Zone Device Structure */
+struct bcm_thermal_zone_priv {
+ char name[THERMAL_NAME_LENGTH];
+ void __iomem *base;
+};
+
+/* Temperature conversion function for TMON block */
+static long raw_to_mcelsius(u32 raw)
+{
+ /*
+* According to Broadcom internal Analog Module Specification
+* the formula for converting TMON block output to temperature in
+* degree Celsius is:
+* T = 428 - (0.561 * raw)
+* Note: the valid operating range for the TMON block is -40C to 125C
+*/
+ return 428000 - (561 * (long)raw);
+}
+
+/* Get temperature
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 23-09-2013 13:51, Wendy Ng wrote:
> This adds the support for reading out temperature from Broadcom bcm281xx
> SoCs.
>
> Signed-off-by: Wendy Ng
> Reviewed-by: Markus Mayer
> Reviewed-by: Christian Daudt
> ---
> .../bindings/thermal/bcm-kona-thermal.txt | 18 +++
> drivers/thermal/Kconfig| 10 ++
> drivers/thermal/Makefile |1 +
> drivers/thermal/bcm_thermal.c | 170
>
> 4 files changed, 199 insertions(+)
> create mode 100644
> Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
> create mode 100644 drivers/thermal/bcm_thermal.c
>
> diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
> b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
> new file mode 100644
> index 000..acca99e
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
> @@ -0,0 +1,18 @@
> +* Broadcom Kona Thermal Management Unit
> +
> +This version is for the BCM281xx family of SoCs.
> +
> +Required properties:
> +- compatible : "brcm,bcm11351-thermal", "brcm,kona-thermal"
> +- reg : Address range of the thermal register
> +- thermal-name: this entry must be specified and it will be passed into
> +thermal_zone_device_register(). This name will also be reported under Hwmon
> +sysfs 'name' attribute.
> +
> +Example:
> + thermal@34008000 {
> + compatible = "brcm,bcm11351-thermal", "brcm,kona-thermal";
> + reg = <0x34008000 0x0024>;
> + thermal-name = "bcm_kona_therm";
> + status = "disabled";
> + };
> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
> index dbfc390..7f823f0 100644
> --- a/drivers/thermal/Kconfig
> +++ b/drivers/thermal/Kconfig
> @@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
> Support for the Kirkwood thermal sensor driver into the Linux thermal
> framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
>
> +config BCM_THERMAL
> + tristate "Temperature sensor on Broadcom BCM281xx family of SoCs"
> + depends on ARCH_BCM
> + default y
> + help
> + If you say yes here you get support for TMU (Thermal Management
> + Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
> + monitoring of CPU clusters, graphics, and SoC glue, but does not
> + include monitoring of charger temperature.
> +
> config DOVE_THERMAL
> tristate "Temperature sensor on Marvell Dove SoCs"
> depends on ARCH_DOVE
> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
> index 584b363..3ea8c1c 100644
> --- a/drivers/thermal/Makefile
> +++ b/drivers/thermal/Makefile
> @@ -21,6 +21,7 @@ obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
> obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
> obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
> obj-y+= samsung/
> +obj-$(CONFIG_BCM_THERMAL) += bcm_thermal.o
> obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
> obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
> obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
> diff --git a/drivers/thermal/bcm_thermal.c b/drivers/thermal/bcm_thermal.c
> new file mode 100644
> index 000..131d3c4
> --- /dev/null
> +++ b/drivers/thermal/bcm_thermal.c
> @@ -0,0 +1,170 @@
> +/*
> + * Copyright 2013 Broadcom Corporation.
> + *
> + * This program is free software; you can redistribute it and/or modify
> + * it under the terms of the GNU General Public License, version 2,
> + * as published by the Free Software Foundation (the "GPL").
> + *
> + * This program is distributed in the hope that it will be useful,
> + * but WITHOUT ANY WARRANTY; without even the implied warranty of
> + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
> + * GNU General Public License for more details.
> + *
> + * A copy of the GPL is available at
> http://www.broadcom.com/licenses/GPLv2.php,
> + * or by writing to the Free Software Foundation, Inc.,
> + * 59 Temple Place - Suite 330, Boston, MA 02111-1307, USA.
> + */
> +
> +/**
> +* Broadcom Thermal Management Unit - bcm_tmu
> +*/
> +#include
> +#include
> +#include
> +#include
> +#include
> +#include
> +#include
> +
> +/* From TMON Register Database */
> +#define TMON_TEMP_VAL_OFFSET 0x001c
> +#define TMON_TEMP_VAL_TEMP_VAL_SHIFT 0
> +#define TMON_TEMP_VAL_TEMP_VAL_MASK 0x03ff
> +
> +/* Broadcom Thermal Zone Device Structure */
> +struct bcm_thermal_zone_priv {
> + char name[THERMAL_NAME_LENGTH];
> + void __iomem *base;
> +};
> +
> +/* Temperature conversion function for TMON block */
> +static long raw_to_mcelsius(u32 raw)
> +{
> + /*
> + * According to Broadcom internal Analog Module Specification
> + * the formula for converting TMON block output to temperature in
> + * degree Celsius is:
> + * T = 428 - (0.561 * raw)
> + * Note: the valid
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 23-09-2013 13:51, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng wendy...@broadcom.com
Reviewed-by: Markus Mayer mma...@broadcom.com
Reviewed-by: Christian Daudt c...@broadcom.com
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : brcm,bcm11351-thermal, brcm,kona-thermal
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported under Hwmon
+sysfs 'name' attribute.
+
+Example:
+ thermal@34008000 {
+ compatible = brcm,bcm11351-thermal, brcm,kona-thermal;
+ reg = 0x34008000 0x0024;
+ thermal-name = bcm_kona_therm;
+ status = disabled;
+ };
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+ tristate Temperature sensor on Broadcom BCM281xx family of SoCs
+ depends on ARCH_BCM
+ default y
+ help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
+
config DOVE_THERMAL
tristate Temperature sensor on Marvell Dove SoCs
depends on ARCH_DOVE
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 584b363..3ea8c1c 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -21,6 +21,7 @@ obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
obj-y+= samsung/
+obj-$(CONFIG_BCM_THERMAL) += bcm_thermal.o
obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
diff --git a/drivers/thermal/bcm_thermal.c b/drivers/thermal/bcm_thermal.c
new file mode 100644
index 000..131d3c4
--- /dev/null
+++ b/drivers/thermal/bcm_thermal.c
@@ -0,0 +1,170 @@
+/*
+ * Copyright 2013 Broadcom Corporation.
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License, version 2,
+ * as published by the Free Software Foundation (the GPL).
+ *
+ * This program is distributed in the hope that it will be useful,
+ * but WITHOUT ANY WARRANTY; without even the implied warranty of
+ * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
+ * GNU General Public License for more details.
+ *
+ * A copy of the GPL is available at
http://www.broadcom.com/licenses/GPLv2.php,
+ * or by writing to the Free Software Foundation, Inc.,
+ * 59 Temple Place - Suite 330, Boston, MA 02111-1307, USA.
+ */
+
+/**
+* Broadcom Thermal Management Unit - bcm_tmu
+*/
+#include linux/module.h
+#include linux/err.h
+#include linux/kernel.h
+#include linux/platform_device.h
+#include linux/io.h
+#include linux/thermal.h
+#include linux/of.h
+
+/* From TMON Register Database */
+#define TMON_TEMP_VAL_OFFSET 0x001c
+#define TMON_TEMP_VAL_TEMP_VAL_SHIFT 0
+#define TMON_TEMP_VAL_TEMP_VAL_MASK 0x03ff
+
+/* Broadcom Thermal Zone Device Structure */
+struct bcm_thermal_zone_priv {
+ char name[THERMAL_NAME_LENGTH];
+ void __iomem *base;
+};
+
+/* Temperature conversion function for TMON block */
+static long raw_to_mcelsius(u32 raw)
+{
+ /*
+ * According to Broadcom internal Analog Module Specification
+ * the formula for converting TMON block output to temperature in
+ * degree Celsius is:
+ * T = 428 - (0.561 * raw)
+ * Note: the
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 9/23/2013 11:19 AM, Eduardo Valentin wrote:
On 23-09-2013 13:51, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng wendy...@broadcom.com
Reviewed-by: Markus Mayer mma...@broadcom.com
Reviewed-by: Christian Daudt c...@broadcom.com
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : brcm,bcm11351-thermal, brcm,kona-thermal
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported under Hwmon
+sysfs 'name' attribute.
+
+Example:
+ thermal@34008000 {
+ compatible = brcm,bcm11351-thermal, brcm,kona-thermal;
+ reg = 0x34008000 0x0024;
+ thermal-name = bcm_kona_therm;
+ status = disabled;
+ };
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+ tristate Temperature sensor on Broadcom BCM281xx family of SoCs
+ depends on ARCH_BCM
+ default y
+ help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
+
config DOVE_THERMAL
tristate Temperature sensor on Marvell Dove SoCs
depends on ARCH_DOVE
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 584b363..3ea8c1c 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -21,6 +21,7 @@ obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
obj-$(CONFIG_RCAR_THERMAL)+= rcar_thermal.o
obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
obj-y += samsung/
+obj-$(CONFIG_BCM_THERMAL) += bcm_thermal.o
obj-$(CONFIG_DOVE_THERMAL)+= dove_thermal.o
obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
diff --git a/drivers/thermal/bcm_thermal.c b/drivers/thermal/bcm_thermal.c
new file mode 100644
index 000..131d3c4
--- /dev/null
+++ b/drivers/thermal/bcm_thermal.c
@@ -0,0 +1,170 @@
+/*
+ * Copyright 2013 Broadcom Corporation.
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License, version 2,
+ * as published by the Free Software Foundation (the GPL).
+ *
+ * This program is distributed in the hope that it will be useful,
+ * but WITHOUT ANY WARRANTY; without even the implied warranty of
+ * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
+ * GNU General Public License for more details.
+ *
+ * A copy of the GPL is available at
http://www.broadcom.com/licenses/GPLv2.php,
+ * or by writing to the Free Software Foundation, Inc.,
+ * 59 Temple Place - Suite 330, Boston, MA 02111-1307, USA.
+ */
+
+/**
+* Broadcom Thermal Management Unit - bcm_tmu
+*/
+#include linux/module.h
+#include linux/err.h
+#include linux/kernel.h
+#include linux/platform_device.h
+#include linux/io.h
+#include linux/thermal.h
+#include linux/of.h
+
+/* From TMON Register Database */
+#define TMON_TEMP_VAL_OFFSET 0x001c
+#define TMON_TEMP_VAL_TEMP_VAL_SHIFT 0
+#define TMON_TEMP_VAL_TEMP_VAL_MASK0x03ff
+
+/* Broadcom Thermal Zone Device Structure */
+struct bcm_thermal_zone_priv {
+ char name[THERMAL_NAME_LENGTH];
+ void __iomem *base;
+};
+
+/* Temperature conversion function for TMON block */
+static long raw_to_mcelsius(u32 raw)
+{
+ /*
+* According to Broadcom internal Analog Module Specification
+* the formula for converting TMON block output to temperature in
+* degree Celsius is:
+* T = 428 - (0.561 * raw)
+* Note: the valid
Re: [PATCH 1/3] thermal: bcm281xx: Add thermal driver
On 23-09-2013 18:43, Wendy Ng wrote:
On 9/23/2013 11:19 AM, Eduardo Valentin wrote:
On 23-09-2013 13:51, Wendy Ng wrote:
This adds the support for reading out temperature from Broadcom bcm281xx
SoCs.
Signed-off-by: Wendy Ng wendy...@broadcom.com
Reviewed-by: Markus Mayer mma...@broadcom.com
Reviewed-by: Christian Daudt c...@broadcom.com
---
.../bindings/thermal/bcm-kona-thermal.txt | 18 +++
drivers/thermal/Kconfig| 10 ++
drivers/thermal/Makefile |1 +
drivers/thermal/bcm_thermal.c | 170
4 files changed, 199 insertions(+)
create mode 100644
Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
create mode 100644 drivers/thermal/bcm_thermal.c
diff --git
a/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
new file mode 100644
index 000..acca99e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/bcm-kona-thermal.txt
@@ -0,0 +1,18 @@
+* Broadcom Kona Thermal Management Unit
+
+This version is for the BCM281xx family of SoCs.
+
+Required properties:
+- compatible : brcm,bcm11351-thermal, brcm,kona-thermal
+- reg : Address range of the thermal register
+- thermal-name: this entry must be specified and it will be passed into
+thermal_zone_device_register(). This name will also be reported
under Hwmon
+sysfs 'name' attribute.
+
+Example:
+thermal@34008000 {
+compatible = brcm,bcm11351-thermal, brcm,kona-thermal;
+reg = 0x34008000 0x0024;
+thermal-name = bcm_kona_therm;
+status = disabled;
+};
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index dbfc390..7f823f0 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -134,6 +134,16 @@ config KIRKWOOD_THERMAL
Support for the Kirkwood thermal sensor driver into the Linux
thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
+config BCM_THERMAL
+tristate Temperature sensor on Broadcom BCM281xx family of SoCs
+depends on ARCH_BCM
+default y
+help
+ If you say yes here you get support for TMU (Thermal Management
+ Unit) on Broadcom BCM281xx family of SoCs. This provides thermal
+ monitoring of CPU clusters, graphics, and SoC glue, but does not
+ include monitoring of charger temperature.
+
config DOVE_THERMAL
tristate Temperature sensor on Marvell Dove SoCs
depends on ARCH_DOVE
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 584b363..3ea8c1c 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -21,6 +21,7 @@ obj-$(CONFIG_SPEAR_THERMAL)+= spear_thermal.o
obj-$(CONFIG_RCAR_THERMAL)+= rcar_thermal.o
obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
obj-y+= samsung/
+obj-$(CONFIG_BCM_THERMAL) += bcm_thermal.o
obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
obj-$(CONFIG_DB8500_THERMAL)+= db8500_thermal.o
obj-$(CONFIG_ARMADA_THERMAL)+= armada_thermal.o
diff --git a/drivers/thermal/bcm_thermal.c
b/drivers/thermal/bcm_thermal.c
new file mode 100644
index 000..131d3c4
--- /dev/null
+++ b/drivers/thermal/bcm_thermal.c
@@ -0,0 +1,170 @@
+/*
+ * Copyright 2013 Broadcom Corporation.
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License, version 2,
+ * as published by the Free Software Foundation (the GPL).
+ *
+ * This program is distributed in the hope that it will be useful,
+ * but WITHOUT ANY WARRANTY; without even the implied warranty of
+ * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
+ * GNU General Public License for more details.
+ *
+ * A copy of the GPL is available at
http://www.broadcom.com/licenses/GPLv2.php,
+ * or by writing to the Free Software Foundation, Inc.,
+ * 59 Temple Place - Suite 330, Boston, MA 02111-1307, USA.
+ */
+
+/**
+* Broadcom Thermal Management Unit - bcm_tmu
+*/
+#include linux/module.h
+#include linux/err.h
+#include linux/kernel.h
+#include linux/platform_device.h
+#include linux/io.h
+#include linux/thermal.h
+#include linux/of.h
+
+/* From TMON Register Database */
+#define TMON_TEMP_VAL_OFFSET0x001c
+#define TMON_TEMP_VAL_TEMP_VAL_SHIFT0
+#define TMON_TEMP_VAL_TEMP_VAL_MASK0x03ff
+
+/* Broadcom Thermal Zone Device Structure */
+struct bcm_thermal_zone_priv {
+char name[THERMAL_NAME_LENGTH];
+void __iomem *base;
+};
+
+/* Temperature conversion function for TMON block */
+static long raw_to_mcelsius(u32 raw)
+{
+/*
+ * According to Broadcom internal Analog Module Specification
+ * the formula for converting TMON block output to temperature in
+ * degree Celsius is:
+ *
