Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation
On Mon, Sep 10, 2012 at 3:25 PM, Zhang Rui rui.zh...@intel.com wrote: Refreshed to remove the notifier mechanism as we do not have a real user of it. if there is no problem, I'll apply the whole patch set to thermal next tree. The removal of notification API looks fine. Thanks for refreshing this. Thanks, Amit Daniel From: Amit Daniel Kachhap amit.kach...@linaro.org Date: Thu, 16 Aug 2012 17:11:40 +0530 This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Cc: Kyungmin Park kmp...@infradead.org Cc: Kukjin Kim kgene@samsung.com Signed-off-by: Zhang Rui rui.zh...@intel.com Signed-off-by: Andrew Morton a...@linux-foundation.org Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com --- Documentation/thermal/cpu-cooling-api.txt | 33 ++ drivers/thermal/Kconfig | 11 + drivers/thermal/Makefile |1 + drivers/thermal/cpu_cooling.c | 450 + include/linux/cpu_cooling.h | 58 5 files changed, 553 insertions(+), 0 deletions(-) create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 include/linux/cpu_cooling.h diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000..6fe9cdb --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,33 @@ +CPU cooling APIs How To +=== + +Written by Amit Daniel Kachhap amit.kach...@linaro.org + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct cpumask *clip_cpus) + +This interface function registers the cpufreq cooling device with the name +thermal-cpufreq-%x. This api can support multiple
Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation
On Monday, September 10, 2012, Rafael J. Wysocki wrote: On Monday, September 10, 2012, Zhang Rui wrote: Refreshed to remove the notifier mechanism as we do not have a real user of it. if there is no problem, I'll apply the whole patch set to thermal next tree. From: Amit Daniel Kachhap amit.kach...@linaro.org Date: Thu, 16 Aug 2012 17:11:40 +0530 This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Cc: Kyungmin Park kmp...@infradead.org Cc: Kukjin Kim kgene@samsung.com Signed-off-by: Zhang Rui rui.zh...@intel.com Signed-off-by: Andrew Morton a...@linux-foundation.org Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com Can you please resend the patch inline (i.e. not as an attachment)? Sorry, it was inline (obviously). I seem to be too tired. Please resend it to linux...@vger.kernel.org. The linux-pm list at linux-foundation.org is not functional any more. Thanks, Rafael -- To unsubscribe from this list: send the line unsubscribe linux-samsung-soc in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation
On Monday, September 10, 2012, Zhang Rui wrote: Refreshed to remove the notifier mechanism as we do not have a real user of it. if there is no problem, I'll apply the whole patch set to thermal next tree. From: Amit Daniel Kachhap amit.kach...@linaro.org Date: Thu, 16 Aug 2012 17:11:40 +0530 This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Cc: Kyungmin Park kmp...@infradead.org Cc: Kukjin Kim kgene@samsung.com Signed-off-by: Zhang Rui rui.zh...@intel.com Signed-off-by: Andrew Morton a...@linux-foundation.org Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com Can you please resend the patch inline (i.e. not as an attachment)? Rafael -- To unsubscribe from this list: send the line unsubscribe linux-samsung-soc in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
