Re: [U-Boot] DA850EVM with USE_NAND config does not pad the AIS file

2014-05-06 Thread Tom Taylor

Hello Heiko,

On 5/6/2014 10:46 AM, Heiko Schocher wrote:

Hello Christian,

Am 06.05.2014 13:30, schrieb Christian Riesch:

Tom,
Thank you very much for your investigations :-)

--On April 26, 2014 13:34 -0400 Tom Taylor ttaylor.ta...@gmail.com 
wrote:


I'm a U-Boot newbie so please feel free to correct how I'm reporting 
this

issue..

I recently downloaded the 2014.04-rc3 snapshot to build U-Boot for my
custom DA850-based board. The only change was to add a new target
dav850evm_nand in boards.cfg with the added parameter USE_NAND.

The resulting AIS file was programmed into EVM-compatible NAND using
standard sfh_OMAP-L138 method.

The board failed to boot, and stayed in a loop printing the SPL console
message repeatedly.

After some debugging with CCS 5.5 and an XDS100v2, I found that 
incorrect
code was being loaded into the 0xc108000 RAM destination. The 
da850evm.h
file defines CONFIG_SYS_NAND_U_BOOT_OFFS as 0x28000, which 
corresponds to
an AIS offset of 0x8000 but the u-boot header did not appear there 
in the

AIS file. A search revealed that the Makefile catenated u-boot
immediately after the SPL without any padding.

Further investigation revealed that the target Makefile needs
CONFIG_SPL_MAX_SIZE to be defined as 0x8000 in order for the padding to
be performed properly; however, this constant was apparently deleted
during a series of changes in April, 2013 to accommodate separate code
and BSS size limits for another target. In its place,
CONFIG_SPL_MAX_FOOTPRINT was defined as 32768. Unfortunately, the
da850evm Makefile does not refer to this constant.

To solve the problem, I added the following 2 lines in my 
custom-modified

da850evm.h:
# define CONFIG_SPL_PAD_TO 0x8000
# define CONFIG_SPL_MAX_SIZE 0x8000

although the first line may not be strictly required.


Yes, CONFIG_SPL_PAD_TO is currently not used for the 'make 
u-boot.ais' target in the Makefile. Instead, the Makefile uses 
CONFIG_SPL_MAX_SIZE for padding the SPL, which is probably wrong.


Yes, CONFIG_SPL_PAD_TO is the correct define. On the other hand
the question is is CONFIG_SPL_PAD_TO not always equal to
CONFIG_SPL_MAX_SIZE ?


This solved the
problem and allowed the board to boot.

Doesn't this mean that other similar targets may be broken?


I think yes.

I think the right fix would be to change the Makefile to use 
CONFIG_SPL_PAD_TO instead of CONFIG_SPL_MAX_SIZE for the u-boot.ais 
target.


diff --git a/Makefile b/Makefile
index ff38a43..869f442 100644
--- a/Makefile
+++ b/Makefile
@@ -890,7 +890,7 @@ MKIMAGEFLAGS_u-boot-spl.ais = -s -n $(if 
$(CONFIG_AIS_CONFIG_FILE), \

spl/u-boot-spl.ais: spl/u-boot-spl.bin FORCE
$(call if_changed,mkimage)

-OBJCOPYFLAGS_u-boot.ais = -I binary -O binary 
--pad-to=$(CONFIG_SPL_MAX_SIZE)
+OBJCOPYFLAGS_u-boot.ais = -I binary -O binary 
--pad-to=$(CONFIG_SPL_PAD_TO)

u-boot.ais: spl/u-boot-spl.ais u-boot.img FORCE
$(call if_changed,pad_cat)


And then check all ARM926EJS/Davinci configurations that use SPL:

(extending Tom Rini's grep command from his email)

$ git grep -l ARM926EJS include/configs/ | xargs grep -l DAVINCI | 
xargs grep -l _SPL_

include/configs/cam_enc_4xx.h
include/configs/da830evm.h
include/configs/da850evm.h
include/configs/hawkboard.h
include/configs/ipam390.h

For the cam_enc_4xx CONFIG_SPL_PAD_TO is already defined, so it 
should work fine after fixing the Makefile. Heiko, any comments on 
this? Are you actually using the u-boot.ais target?


I have no board to test, but I think it is used.

da830evm and hawkboard did not use CONFIG_SPL_MAX_SIZE, so no need to 
fix them.


da850evm: We should add CONFIG_SPL_PAD_TO as already suggested by you.




ipam390.h: I think the #define CONFIG_SPL_MAX_SIZE 0x2 should be 
removed or replaced by #define CONFIG_SPL_PAD_TO 0x2. But 
actually the board has been added after the commits that replace grep 
-lr CONFIG_SPL_MAX_SIZE by CONFIG_SPL_MAX_FOOTPRINT, so why
didn't that issue come up when adding the board to mainline? Heiko, 
any comments? Are you using make u-boot.ais here or something else?


I am not sure, if we can just remove CONFIG_SPL_MAX_SIZE for this
board, as it maybe has only 0x2 space for the SPL ?

maybe:

#if !defined(CONFIG_SPL_PAD_TO)
define CONFIG_SPL_PAD_TO CONFIG_SPL_MAX_SIZE
#endif

is better? Heh, thats the case, see:

./include/config_fallbacks.h

so, your Makefile patch should be Ok ...

bye,
Heiko
There's currently only 0x8000 space allocated for the SPL.  The first 
0x2 byte block is allocated for the NAND-resident environment.  From 
da850evm.h:


#ifdef CONFIG_USE_NAND
  :
#define CONFIG_ENV_OFFSET0x0 /* Block 0--not used by bootcode */
#define CONFIG_ENV_SIZE(128  10)

Anyone customizing the build has to of course ensure that that the boot 
offset passed to nand_spl_load_image() is consistent .  Again from 
da850evm.h:


#define CONFIG_SYS_NAND_U_BOOT_OFFS0x28000

Because of include/config_fallbacks, it would seem like Christian's 
suggestion to change

[U-Boot] DA850EVM with USE_NAND config does not pad the AIS file

2014-04-26 Thread Tom Taylor
I'm a U-Boot newbie so please feel free to correct how I'm reporting 
this issue..


I recently downloaded the 2014.04-rc3 snapshot to build U-Boot for my 
custom DA850-based board.  The only change was to add a new target 
dav850evm_nand in boards.cfg with the added parameter USE_NAND.


The resulting AIS file was programmed into EVM-compatible NAND using 
standard sfh_OMAP-L138 method.


The board failed to boot, and stayed in a loop printing the SPL console 
message repeatedly.


After some debugging with CCS 5.5 and an XDS100v2, I found that 
incorrect code was being loaded into the 0xc108000 RAM destination. The 
da850evm.h file defines CONFIG_SYS_NAND_U_BOOT_OFFS as 0x28000, which 
corresponds to an AIS offset of 0x8000 but the u-boot header did not 
appear there in the AIS file.  A search revealed that the Makefile 
catenated u-boot immediately after the SPL without any padding.


Further investigation revealed that the target Makefile needs 
CONFIG_SPL_MAX_SIZE to be defined as 0x8000 in order for the padding to 
be performed properly; however, this constant was apparently deleted 
during a series of changes in April, 2013 to accommodate separate code 
and BSS size limits for another target.  In its place, 
CONFIG_SPL_MAX_FOOTPRINT was defined as 32768.   Unfortunately, the 
da850evm Makefile does not refer to this constant.


To solve the problem, I added the following 2 lines in my 
custom-modified da850evm.h:

#define CONFIG_SPL_PAD_TO0x8000
#define CONFIG_SPL_MAX_SIZE  0x8000

although the first line may not be strictly required.  This solved the 
problem and allowed the board to boot.


Doesn't this mean that other similar targets may be broken?

How can I assist with contributing the patch to fix this?  One problem I 
have is that I only have an EXP, not an EVM board.  My custom target 
board shares some features with the EVM such as NOR and NAND memory, but 
other things are different like the use of a fixed PHY.  This makes it 
impossible for me to completely verify a da850evm build.


I would like to see more target configurations available for the 
DA850EVM but it seems like development for this has stopped.  NAND boot 
was a simple change, but adding USB support required me to copy  paste 
code from the da830evm target.  Are there any future plans to do this, 
or will I need to do this development for my custom board only?


Tom Taylor
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