Dear Jorge Rabadan, Senthil Sathappan, Wim Henderickx, Senad Palislamovic, 
Florin Balus, Ali Sajassi, Dennis Cai:


An IPR disclosure that pertains to your Internet-Draft entitled
"Interconnect Solution for EVPN Overlay networks"
(draft-ietf-bess-dci-evpn-overlay) was submitted to the IETF Secretariat on  and
has been posted on the "IETF Page of Intellectual Property Rights Disclosures"
(https://datatracker.ietf.org/ipr/2586/). The title of the IPR disclosure is
"Huawei Technologies Co.,Ltd's Statement about IPR related to
draft-ietf-bess-dci-evpn-overlay"


Thank you

IETF Secretariat

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