Dear Jorge Rabadan, Senthil Sathappan, Wim Henderickx, Senad Palislamovic, Florin Balus, Ali Sajassi, Dennis Cai:
An IPR disclosure that pertains to your Internet-Draft entitled "Interconnect Solution for EVPN Overlay networks" (draft-ietf-bess-dci-evpn-overlay) was submitted to the IETF Secretariat on and has been posted on the "IETF Page of Intellectual Property Rights Disclosures" (https://datatracker.ietf.org/ipr/2586/). The title of the IPR disclosure is "Huawei Technologies Co.,Ltd's Statement about IPR related to draft-ietf-bess-dci-evpn-overlay" Thank you IETF Secretariat _______________________________________________ BESS mailing list BESS@ietf.org https://www.ietf.org/mailman/listinfo/bess