Re: [QtMoko] MokoFaen theme v2
On Sunday, July 01, 2012 12:34:19 PM francesco.dev...@mailoo.org wrote: Hi people! Here for you it's the new version of MokoFaen theme, and if the numbers do not deceive me it is the release 2 (: The theme is available at [1], svg and sources at [2]. You can simply copy-past the whole directory opt [1] in your qtmoko root, or you can wait that someone makes the deb package (please do the deb for me (: I promise I'll learn how to do it next time! use [1]) Hi! great to see it, i will package it up then - just after i am done with couple of other things. Thanks! Radek ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
Re: Faenqomod new title.xml file
On Sunday, July 01, 2012 06:49:49 PM adrien wrote: Hi community, I'm pleased to show my hacks on the faenqomod to have new wifi and gps buttons in the title bar (taken from finxi theme) and to be able to always show/mask keyboard. Hi Adrien, nice, i will take a look at it/commit and make packages. Thanks a lot Radek ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
Re: Status OpenPhoneux / GTA04
Hi all, I did a long telephone call this morning to discuss the production situation of the GTA04A4 boards. Am 25.06.2012 um 20:56 schrieb Dr. H. Nikolaus Schaller: Hi, Am 25.06.2012 um 16:16 schrieb Gilles Filippini: Hi Nikolaus, Dr. H. Nikolaus Schaller a écrit , Le 31/05/2012 17:36: So please expect that it will become End of June for delivery... Since we are near to End of June, time for asking how is it going? ;) Neither good nor bad... This means: * we have already shipped some of the GTA04 Group Tour boards * some friends have upgraded to a complete OpenPhoenux (we have a handful reworked GTA02) * but we still have a list of open orders for roughly 90 GTA04 Group Tour boards The production company had stopped again to do some more analyses and the last status I received today is that they had again made some X-Ray. Now they think they can again optimize the soldering process a little so that we don't get so much broken boards that need manual rework. So here is a copy of the latest X-Ray image of the DM3730CBP with short circuits: http://download.goldelico.com/gta04/images/20120622-GTA04A4-schlecht-01.jpg If you want to compare to the GTA04A3 board X-Ray (with one short): http://download.goldelico.com/gta04/images/20110707-GTA04A3-schlecht-xr002.jpg or the GTA04A2 board (where only 1 unit exists): http://download.goldelico.com/gta04/images/20101109-GTA04A2-overview.jpg Every rework ruins some components (unfortunately 1 DM3730 + 1 Memory chip 50 EUR) and costs intensive working time. And we simply can't afford that if it happens too often... So the highest priority is to get rid of the root cause for these soldering failures. After analyzing and discussing the X-Ray images we now think we understand what happens (but you never know if you are right...). The reason appears that the DM3730CBP gets some warp during the soldering process squeezing the balls in the middle of the BGA grid so that they may touch a neighbor and make a short circuit. And on the corners the balls lift off and this may result in interruptions. This theory correlates exactly with the error patterns we see: * some 50% of the boards come out of the soldering process with shorts on VDD1, VDD2 and/or VIO which are mostly available on the center balls * if the chip has no short on the power supply or is reworked some 50% of the boards have interruptions which makes a single function fail. Sometimes the SD interface has just 3 data lines, sometimes the WLAN chip. Sometimes some sensor is not working. Sometimes the USB is not working, or one display data link distorting the colors etc. Now comes the crucial question: how can this be improved? The specialists of the production company have spent whole weekends to do more experiments but did not yet find the right trick. It is not that they do not want to solve the problem (they see it as a challenge) they simply have not yet found the key. One factor is that our GTA04 board has exceptionally squeezed components (since we must be small) so the soldering of a OpenPandora or the BeagleBoard may be a little easier from heat distribution. I.e. we are pushing an experienced EMS to their limits... An EMS who has produced more than 2000 different products in small quantities (which is their strength) including some 0.4mm BGAs. A new experiment is scheduled for week 29 to use a different reflow soldering machine and process which uses a little lower temperature. Unfortunately, we can't contribute to this production improvement to speed things up. Unless one of the readers on these list knows some real specialist for such PoP soldering of BGAs who is willing and capable to consult (even if it costs money). So if you know someone, please let me know. The good answer is that as soon as we decide to continue, So we had to decide to wait for the different reflow soldering process first. it takes less than 4 weeks to produce, test and ship all missing boards. They have planned that it works even if holiday season is coming. And our shipment plan is by sequence of order. So if you did order early, it is even a little closer. So it is a stony path towards a community driven independently developed and produced open smartphone platform. But Rome wasn't built in one day... And we have to solve this issue before we can start to think about a future quad core LTE device with multitouch... Please keep the faith. BR, Nikolaus ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
Re: Faenqomod new title.xml file
hi adrien, do you use some special software (qt designer, ...) to do the layout edits? or do you have any hints on how to get started with the theme editing? best regards robin ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
Re: Faenqomod new title.xml file
l 03/07/2012 11:19, robin ha scritto: do you use some special software (qt designer, ...) to do the layout edits? or do you have any hints on how to get started with the theme editing? A theme is made of xml files and images in svg or png (or the exotic .pic format). You can simply use a text editor to manipulate the xml and a software such as inkscape to make the images for the icons and other parts of a theme. You can find the xmls in /opt/qtmoko/etc/themes/ . If you follow the discussion on MokoFaen v2 theme, you can download all the file you need to start studying and hacking the theme ;) Regards Joif ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
Re: Status OpenPhoneux / GTA04
Thanks for your update! It takes the open phone concept a little further, if we have even x-rays of the boards ;-) Kind regards, @ On Tuesday 03 July 2012 11:15:16 Dr. H. Nikolaus Schaller wrote: Hi all, I did a long telephone call this morning to discuss the production situation of the GTA04A4 boards. Am 25.06.2012 um 20:56 schrieb Dr. H. Nikolaus Schaller: Hi, Am 25.06.2012 um 16:16 schrieb Gilles Filippini: Hi Nikolaus, Dr. H. Nikolaus Schaller a écrit , Le 31/05/2012 17:36: So please expect that it will become End of June for delivery... Since we are near to End of June, time for asking how is it going? ;) Neither good nor bad... This means: * we have already shipped some of the GTA04 Group Tour boards * some friends have upgraded to a complete OpenPhoenux (we have a handful reworked GTA02) * but we still have a list of open orders for roughly 90 GTA04 Group Tour boards The production company had stopped again to do some more analyses and the last status I received today is that they had again made some X-Ray. Now they think they can again optimize the soldering process a little so that we don't get so much broken boards that need manual rework. So here is a copy of the latest X-Ray image of the DM3730CBP with short circuits: http://download.goldelico.com/gta04/images/20120622-GTA04A4- schlecht-01.jpg If you want to compare to the GTA04A3 board X-Ray (with one short): http://download.goldelico.com/gta04/images/20110707-GTA04A3-schlecht- xr002. jpg or the GTA04A2 board (where only 1 unit exists): http://download.goldelico.com/gta04/images/20101109-GTA04A2-overview.jpg Every rework ruins some components (unfortunately 1 DM3730 + 1 Memory chip 50 EUR) and costs intensive working time. And we simply can't afford that if it happens too often... So the highest priority is to get rid of the root cause for these soldering failures. After analyzing and discussing the X-Ray images we now think we understand what happens (but you never know if you are right...). The reason appears that the DM3730CBP gets some warp during the soldering process squeezing the balls in the middle of the BGA grid so that they may touch a neighbor and make a short circuit. And on the corners the balls lift off and this may result in interruptions. This theory correlates exactly with the error patterns we see: * some 50% of the boards come out of the soldering process with shorts on VDD1, VDD2 and/or VIO which are mostly available on the center balls * if the chip has no short on the power supply or is reworked some 50% of the boards have interruptions which makes a single function fail. Sometimes the SD interface has just 3 data lines, sometimes the WLAN chip. Sometimes some sensor is not working. Sometimes the USB is not working, or one display data link distorting the colors etc. Now comes the crucial question: how can this be improved? The specialists of the production company have spent whole weekends to do more experiments but did not yet find the right trick. It is not that they do not want to solve the problem (they see it as a challenge) they simply have not yet found the key. One factor is that our GTA04 board has exceptionally squeezed components (since we must be small) so the soldering of a OpenPandora or the BeagleBoard may be a little easier from heat distribution. I.e. we are pushing an experienced EMS to their limits... An EMS who has produced more than 2000 different products in small quantities (which is their strength) including some 0.4mm BGAs. A new experiment is scheduled for week 29 to use a different reflow soldering machine and process which uses a little lower temperature. Unfortunately, we can't contribute to this production improvement to speed things up. Unless one of the readers on these list knows some real specialist for such PoP soldering of BGAs who is willing and capable to consult (even if it costs money). So if you know someone, please let me know. The good answer is that as soon as we decide to continue, So we had to decide to wait for the different reflow soldering process first. it takes less than 4 weeks to produce, test and ship all missing boards. They have planned that it works even if holiday season is coming. And our shipment plan is by sequence of order. So if you did order early, it is even a little closer. So it is a stony path towards a community driven independently developed and produced open smartphone platform. But Rome wasn't built in one day... And we have to solve this issue before we can start to think about a future quad core LTE device with multitouch... Please keep the faith. BR, Nikolaus ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
Re: Faenqomod new title.xml file
hi, Le mardi 03 juillet 2012 à 11:36 +0200, francesco.dev...@mailoo.org a écrit : l 03/07/2012 11:19, robin ha scritto: do you use some special software (qt designer, ...) to do the layout edits? or do you have any hints on how to get started with the theme editing? A theme is made of xml files and images in svg or png (or the exotic .pic format). You can simply use a text editor to manipulate the xml That's exactly what I've done : I used nano to edit the xml file and restart some times the service qtmoko-neo to see changes. a software such as inkscape to make the images for the icons and other parts of a theme. I didn't modified icons, but I've just copied some existants from finxi (the icon directories are in /opt/qtmoko/pics/themes). Regards, Adrien ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
Re: [Gta04-owner] Status OpenPhoneux / GTA04
On 03/07/12 11.15, Dr. H. Nikolaus Schaller wrote: ... Now comes the crucial question: how can this be improved? The specialists of the production company have spent whole weekends to do more experiments but did not yet find the right trick. It is not that they do not want to solve the problem (they see it as a challenge) they simply have not yet found the key. ... Unless one of the readers on these list knows some real specialist for such PoP soldering of BGAs who is willing and capable to consult (even if it costs money). So if you know someone, please let me know. ... Hi Nikolaus I have no experience with BGA soldering, but here are some (untested) suggestions. I have no idea what is possible. Maybe it might add to a solution?: * Use an heat infrared camera to see during soldering (and passive cooling) how the BGA-chip temperature is distributed during the process - if possible - even of the PCB underside. * If BGA-chip bulges it maybe that it is too cool at the periphery? Can the periphery be heated more? Or be heat-isolated more during passive cooling - or cool the BGA-center more than the periphery? Maybe the PCB just opposite the BGA should have the opposite treatment during the cooling process? * Make hollow BGA PCB-islands where to much or to little solder can flow through? The melted solder adhersion should keep the solder where it belongs? * Maybe this paper has the answer?: BGA rework A comparitive study of selective solder paste deposition for area array packages. Ray Cirimele BEST, Inc. Rolling Meadows, Illinois rcirimele@solder: http://www.solder.net/stencilquik/papers/SMT_PANPAC_Paper_Rev032704.pdf Quote: ... There has been much controversy over whether BGA solder joint reliability is better when processed with solder paste versus paste flux. Some studies1,2 indicate that the solder joint shape may have a greater impact on the solder joint reliability than the volume. ... Figure 1. An open connection caused from poor coplanarity and the use of flux instead of paste. ... Many things can affect the coplanarity. If the BGA has solder balls that are not coplanar it can result in a open connection (a ball that has not contacted and wetted the land while surrounding balls have made contact). Variations in surface finish height, warp of the board or area, and warp or bow of the device itself can create coplanarity problems. The use of solder paste can help to overcome variations in solder ball height. The use of solder paste may also improve wetting as a result of a greater area of intimate contact between the ball and the paste and the land and the paste. Solder paste may provide better tack than flux alone. On newer technology PCBs, the utilization of drilled (usually laser) micro-vias in the center of the BGA land requires the use of solder paste to reduce voiding and to prevent loss of the solder ball volume as a result of filling the via. ... Although there are many ways to replace the Area Array devices using flux, solder paste, or solder bumps, only the four most common methods of solder paste deposition will be discussed. ... Stand Off There are some BGA devices with eutectic solder balls that tend to exhibit a great deal of ball collapse after reflow. This can be caused from design (land size) or BGA weight. Many times this excessive collapse can result in solder shorts (usually in the corners). Generally, greater stand-off height in conjunction with proper solder volumes and shape can provide better solder joint reliability. The semi- permanent stencil will prevent excessive collapse of the solder balls and can be used to provide a minimum stand-off height. Solder Shorts Solder shorts can occur on BGA devices for a number of reasons. Most of these reasons have to do with the solder paste deposition or excessive collapse of the solder balls causing an increase in the ball diameter and a reduction in the ball spacing. One clear advantage that the semi- permanent stencil has over the other stencils is that it acts as a physical barrier to prevent solder shorts from occurring. The non-wettable polyimide film holds the solder paste in the stencil apertures, and once the solder becomes molten it coalesces and cannot migrate over the stencil. ... Solder Volume Based on previous works done on the relationship between BGA solder joint quantity and solder joint strength and reliability, greater solder quantities generally result in greater joint strength. Some studies indicate that solder joint shape may have as much to do with joint strength as the solder volume. Greater stand-off heights with a fillet shaped like an hour glass may provide better reliability than a traditional rounded collapsed ball shape1,2. ... CONCLUSION Although stencils have been used in the electronics industry for many years, the use has been plagued by the impact of the removal of the stencil from the substrate. Through the use
Re: [Gta04-owner] Status OpenPhoneux / GTA04
FYI: Surface Mount Technology Association (SMTA): http://www.linkedin.com/groupItem?seeMore=split_page=2type=memberitem=57473744gid=49934 Quote: ... Surface Mount Technology Association (SMTA) is now an open group ... br, Glenn ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
Re: [Gta04-owner] Status OpenPhoneux / GTA04
More - german placed company: Soldering BGAs by Hook or by Crook Dr. Hans Bell, rehm Anlagenbau GmbH + Co. KG and Marco Kämpfert, TechnoLab: http://www.technolab.de/_en/downloads/bgabellkaempferte.pdf Quote: ... In addition to the popcorn effect, non-uniform heat input to the PCB or the PBGA may cause delaminating or twisting, as well as warping of the PBGA substrate and the PCB. The substrate is warped like a bimetallic strip. Shorts and opens often result, as is shown very nicely in Rupprecht’s photos [5]. ... Heat from below, encompassing the entire surface of the PCB, is ideal for rework. The amount of heat input from below may even exceed the amount from above in some cases. If (nearly) eutectic tin-lead solder pastes and soft balls are utilized (BGA balls made from soft solder), the customary reflow parameters are recommended for ball solder joints: 30 to 60 seconds at 200 to 220° C. The best measuring method involves the use of a thermocouple which is placed directly at the ball by inserting it through a suitable drill-hole, as shown in figure 5.2. ... In order to avoid the popcorn effect (the formation of fissures inside the BGA during exposure to heat), it is absolutely essential to observe the specified humidity rating (see JEDEC), as well as the working conditions which result therefrom. It is often advisable to temper BGAs, and in particular PBGAs, before they are processed (see IPC – SM – 786). Formation of Voids A frequently observed phenomenon is the formation of voids in the solder joints, as is shown in figure 5.4. ... Lee provides an excellent overview regarding the formation and prevention of voids when soldering PBGAs [8]. Voids can usually be traced back to outgassing which is caused by flux in the solder paste. A small number of voids does not effect solder joint reliability. To a certain degree, it has even been observed that reliability is improved by voids because they prevent the spreading of fissures. However, under no circumstances should any faith be placed in this phenomenon. ... br, Glenn ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
New Phoronix article on Gta04
http://www.phoronix.com/scan.php?page=news_itempx=MTEzMjI If you missed it. Sadly he doesn't make much constructive criticism; he bashes the specs but it's not as if much can be done about that now. He does mention some good things such as where it is manufactured, being able to run debian/shr/qtmoko... and in his defense, I can't think of too many more good points. Maybe we can put up a 'feature list' of good points that reporters like him can use when writing articles on the GTA04. Please add them to http://wiki.openmoko.org/wiki/Marketing_GTA04#Good_reasons_to_purchase_a_GTA04 or reply to this thread and I will add them to the page at the end of the week. To get the ball rolling I have: * Run qtmoko, SHR, Debian fully supported * Made in Germany under proper working conditions. ___ Openmoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community
