Re: mold linker

2022-03-02 Thread Jakub Jelinek
On Wed, Mar 02, 2022 at 04:26:11PM -0500, Ken Dreyer wrote: > Some of the Ceph developers were investigating mold, since Ceph takes > so long to build. Linking time is a problem for us with Ceph. But I > don't know if those interested Ceph developers have done benchmarks > yet. > > And the lack

Re: mold linker

2022-03-02 Thread Ken Dreyer
On Wed, Mar 2, 2022 at 2:16 PM Jakub Jelinek wrote: > > On Wed, Mar 02, 2022 at 01:29:00PM -0500, Ben Beasley wrote: > > In RPM packaging, of course, everything is built from scratch, usually with > > LTO, and a package that takes a minute to link probably takes an hour to > > build. While any

Re: mold linker

2022-03-02 Thread Jakub Jelinek
On Wed, Mar 02, 2022 at 01:29:00PM -0500, Ben Beasley wrote: > In RPM packaging, of course, everything is built from scratch, usually with > LTO, and a package that takes a minute to link probably takes an hour to > build. While any work that can be saved in an RPM build is helpful, I think > the

Re: mold linker

2022-03-02 Thread Michael Catanzaro
On Wed, Mar 2 2022 at 05:37:35 PM +, Mattia Verga via devel wrote: Accordingly to upstream presentation, it seems to have far better performances than lld, especially when building big projects... A WebKit developer put this to the test recently:

Re: mold linker

2022-03-02 Thread Ben Beasley
I’m not very familiar with mold’s pros and cons other than its speed, but I think that architecture limitations[1] will limit widespread adoption for the time being: || # mold can currently produce native binaries for x86, aarch64 and riscv64 only ExclusiveArch: x86_64

mold linker

2022-03-02 Thread Mattia Verga via devel
disclaimer: I'm a real noob about this topic, so forgive me if I'm starting a useless discussion. I came across 'mold' project [1], which is a GNU Gold / LLVM lld replacement with multi-core support. Accordingly to upstream presentation, it seems to have far better performances than lld,