Hi All, My Technical Tidbit article for this month discusses avoiding ESD events when system modules or connectors make contact by using static dissipative materials in plastic parts, a technique normally used to reduce static charge in factory environments.
Minimizing ESD Events Involving Electronic Equipment (Using Static Dissipative Materials in Equipment Design) Abstract: Electrostatic Discharge (ESD) can cause electronic system malfunction or even damage to circuits. The use of static dissipative materials in system construction can eliminate many ESD events, This subject has been talked about in technical circles for years now and is the topic of this Technical Tidbit article. A new patent is referenced that was recently issued and describes just such an approach to connector design. The link to the article is the picture of two connectors in close proximity at the bottom of the home page at: http://emcesd.com Doug -- ___ _ Doug Smith \ / ) P.O. Box 1457 ========= Los Gatos, CA 95031-1457 _ / \ / \ _ TEL/FAX: 408-356-4186/358-3799 / /\ \ ] / /\ \ Mobile: 408-858-4528 | q-----( ) | o | Email: d...@dsmith.org \ _ / ] \ _ / Web: http://www.dsmith.org - This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to emc-p...@ieee.org Instructions: http://listserv.ieee.org/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas emcp...@ptcnh.net Mike Cantwell mcantw...@ieee.org For policy questions, send mail to: Jim Bacher: j.bac...@ieee.org David Heald: emc-p...@daveheald.com All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
