Texas Instruments (TI) has switched to a palladium lead finish to address
European environmental concerns associated with lead disposal. There have
been documented failures of the hygroscopic dust test attributed to
palladium coated leads. TI is aware of the problem, but to my knowledge
nothing
John,
Excessive voltage gradients are what causes failures in this test. I'd
suggest looking at each chip and finding the worst case voltage gradients
between pins. You can start with your supply voltage (battery or AC) to
ground separations. If you have a voltage gradient in excess of
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