Hi there,
here is a short update.
I am still waiting for that the production company works on the 4 PCBs
in a panel according to my ideas. So there is no news from that experiment.
But I think I have found why there seems to be a problem with IrDA
and why WLAN/Bluetooth are not working.
The reas
Hi,
> Am 08.10.2016 um 08:39 schrieb dalo...@gmail.com:
>
> Hi Nikolaus (and others),
>
> About the shorts on the DM3730, i asked some profs in university about it.
Good!
> Maybe i'm late.
>
> One prof told me (rephrasing):
> There are 3 things to check but considering the setup described, t
Hi Nikolaus (and others),
About the shorts on the DM3730, i asked some profs in university about it.
Maybe i'm late.
One prof told me (rephrasing):
There are 3 things to check but considering the setup described, the
people (you) know what they are doing. It is not a bad thing to remind
them of
On Monday, October 3, 2016 12:50:39 PM CEST H. Nikolaus Schaller wrote:
> DSC!2693.jpeg
> The big question I have discuss with the production company is how to
> glue this very small patch of kapton tape during production...
The phone makes true its name right from the start ;-)
Thanks for the con
Hi,
a short update right from the lab:
> Am 27.09.2016 um 17:07 schrieb H. Nikolaus Schaller :
>
>
>> Am 27.09.2016 um 16:08 schrieb tgrauss :
>>
>> The "Solder Paste Dipping" on page 3 is a very interesting chapter. It is
>> more related to BGA soldering than PoP.
>
> Yes indeed. I have neve
> Am 27.09.2016 um 16:08 schrieb tgrauss :
>
> The "Solder Paste Dipping" on page 3 is a very interesting chapter. It is
> more related to BGA soldering than PoP.
Yes indeed. I have never heard about that and it does not really seem to be a
common method in 2016.
And I am not sure if it would
The "Solder Paste Dipping" on page 3 is a very interesting chapter. It
is more related to BGA soldering than PoP.
Best regards
Thierry
On 27/09/2016 16:05, H. Nikolaus Schaller wrote:
Hi Thierry,
Am 27.09.2016 um 15:16 schrieb tgrauss :
Hello,
Did you see this paper
http://www.nordson.
Hi Thierry,
> Am 27.09.2016 um 15:16 schrieb tgrauss :
>
> Hello,
>
>
>
> Did you see this paper
> http://www.nordson.com/-/media/Files/Nordson/dage/Products/X-ray-Technical-Papers-and-Articles/Semiconductor-Inspection-and-Assembly/POP-paper-SMTA-2009-final.pdf
> ?
Not yet. It is really wel
Hello,
Did you see this paper
http://www.nordson.com/-/media/Files/Nordson/dage/Products/X-ray-Technical-Papers-and-Articles/Semiconductor-Inspection-and-Assembly/POP-paper-SMTA-2009-final.pdf
?
They are giving other possible soldering failure causes for POP
packages. I hope this will help...
